Method of generating patterns on doubly-curved surfaces
View Patent ↗Disclosed is a system and method for patterning internal and/or external doubly-curved surfaces by use of a light source, three-dimensional scanning optics, computer controller, and a multi-axis robot. The system is capable of digitally receiving shape, location, and pattern data of a three-dimensional doubly-curved surface and applying said pattern over large areas with high precision in a seamless fashion.
1. A method of forming a pattern on a doubly-curved surface comprising:
(a) providing a substrate having a doubly-curved surface mounted for rotation about an axis of the substrate;
(b) providing an optical system in relation to the substrate, the optical system operative for projecting a focal point of light to different points of the doubly-curved surface that are different distances from focusing optics of the optical system; and
(c) under the control of a software controlled computer controller, rotating the substrate about its axis in coordination with the operation of the optical system to move the focal point of light in a pattern on the doubly-curved surface.
2. The method of claim 1 , wherein step (c) includes adjusting the focusing optics to maintain the focal point of light in focus on the different points of the doubly-curved surface that are at different distances from the focusing optics.
3. The method of claim 1 , wherein:
the doubly-curved surface comprises a conductive film on a dielectric; and
step (c) includes ablating the conductive film in the pattern on the dielectric.
4. The method of claim 3 , wherein:
the conductive film is polymer based; and
the method further includes curing the polymer based conductive film after ablation.
5. The method of claim 3 , wherein:
the conductive film is an uncured ceramic; and
the method includes sintering the uncured ceramic conductive film after ablation.
6. The method of claim 1 , wherein:
the doubly-curved surface comprises a photoresist on a conductive film on a dielectric;
step (c) includes exposing the photoresist in the pattern on the conductive film.
7. The method of claim 6 , further including, following step (c), photolithographically processing the photoresist and the conductive film to define a circuit on the dielectric.
8. The method of claim 1 , wherein the optical system includes in the following order:
a light source;
an attenuator;
a beam expander;
the focusing optics;
a galvanometer; and
a focusing objective.
9. The method of claim 8 , wherein the optical system further includes a mirror after the focusing objective.
10. The method of claim 8 , further including translating the substrate toward and away from the focusing objective.
11. The method of claim 8 , further including translating the galvanometer toward and away from the focusing optics.
12. The method of claim 1 , wherein the doubly-curved surface is either an interior surface of the substrate or an exterior surface of the substrate.
13. A method of forming a pattern on a doubly-curved surface comprising:
(a) causing a focal point of a light beam to appear at a first point on a doubly-curved surface;
(b) changing a focal length of the light beam in step (a); and
(c) causing the focal point of the light beam changed in step (b) to appear at a second point on the doubly-curved surface.
14. The method of claim 13 , further including:
(d) changing the focal length of the light beam in step (c); and
(e) causing the focal point of the light beam changed in step (d) to appear at a third point on the doubly-curved surface, wherein the first, second, and third points are at different focal lengths of the light beam.
15. The method of claim 13 , wherein the doubly-curved surface has, at each of the first and second points, a first radius of curvature in first direction and a second radius of curvature in second, orthogonal direction.
16. The method of claim 13 , further including rotating or translating the surface relative to a propagation direction of the light beam.
17. The method of claim 13 , wherein steps (b) and (d) further include changing a propagation direction of the light beam relative to the surface.
18. The method of claim 17 , wherein steps (b) and (d) include at least one of the following:
changing the focal point of the light beam in a Z-axis; and
changing the propagation direction of the light beam in an X-axis, a Y-axis, or both X- and Y-axes.
19. The method of claim 13 , wherein the pattern is formed by the focal points of lights by ablation of a material.
20. The method of claim 13 , wherein the pattern is formed by the focal points of lights exposing a photoresist.