IP Library › Patent Application 14216502
Patent Application
App. No. 14/216,502

SURFACE TREATED ALUMINUM FOIL FOR ELECTRONIC CIRCUITS

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Quick Facts
Patent No.
US None
App. No.
14/216,502
Abstract

The surface of an aluminum substrate is modified to enhance the adhesion of the metal to polymeric materials. Intermediate layers, such as Zn/Sn, Co/Ni, and a Cu strike are applied before depositing a nodular Cu layer for bond enhancement. The surface treated aluminum substrate can be used in printed circuit boards, leadframes, or any electrical/electronic devices where Cu is typically used to reduce the cost and weight of the devices.

Claims (6)

1 . A surface treated aluminum foil composite, comprising:

an aluminum foil layer;

a zinc layer on at least one face of the aluminum foil;

a nickel layer over the zinc layer;

a copper strike over the nickel layer; and

adhesion enhancing copper nodules on the copper strike.

Assignments (3)
SECURITY INTEREST Recorded Jul 19, 2016
From: GBC METALS, LLC (F/K/A GLOBAL METALS, LLC)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 039394/0160 →
SECURITY INTEREST (TERM LOAN) Recorded Jul 19, 2016
From: GBC METALS, LLC (F/K/A GLOBAL METALS, LLC)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 039394/0189 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2014
From: CHEN, SZUCHAIN F.
To: GBC METALS, LLC
Reel/Frame 033241/0137 →