Making multi-layer micro-wire structure
View Patent ↗A method of making a multi-layer micro-wire structure includes providing a substrate with a micro-wire layer having first and second areas. The micro-wire layer includes first and second micro-wire electrodes and first and second connection pads in the first and second areas, respectively. Each micro-wire electrode includes one or more electrically connected micro-wires and is electrically connected to a connection pad. The micro-wires are located in a common step. The first area is separated from the second area and the first area of the substrate and the second area of the micro-wire layer are located between the first micro-wires and the second area of the substrate so that a second layer edge extends at least partly beyond a first layer edge and one or more of the second connection pads is located between at least a portion of the first layer edge and the second layer edge.
1. A method of making a multi-layer micro-wire structure, comprising:
providing a substrate having first and second distinct and separated areas;
locating a micro-wire layer in contact with the substrate, the micro-wire layer having a first layer edge and a second layer edge different from the first layer edge, the micro-wire layer having first and second distinct and separated areas spatially corresponding to the first and second distinct and separated areas of the substrate;
the micro-wire layer including one or more first micro-wire electrodes and one or more first connection pads in the micro-wire layer in the first area, each first micro-wire electrode including one or more electrically connected first micro-wires, and each first connection pad electrically connected to a corresponding first micro-wire electrode;
the micro-wire layer including one or more second micro-wire electrodes and one or more second connection pads in the micro-wire layer in the second area, each second micro-wire electrode including one or more electrically connected second micro-wires, and each second connection pad electrically connected to a corresponding second micro-wire electrode, wherein the first micro-wires and the second micro-wires are located in a common step;
separating the first area from the second area and locating the first area of the substrate and the second area of the micro-wire layer between the first micro-wires and the second area of the substrate so that the second layer edge extends at least partly beyond the first layer edge and one or more of the second connection pads is located between at least a portion of the first layer edge and the second layer edge; and
removing the second area of the substrate and laminating the second area of the micro-wire layer to another substrate.
2. The method of claim 1 , further including adhering the second area of the micro-wire layer to the first area of the substrate on a side of the substrate opposing the first micro-wires.
3. The method of claim 1 , further including locating a protective layer in contact with at least the first and second areas of the micro-wire layer so that the first and second micro-wires are between the protective layer and the substrate, the protective layer having first and second distinct and separated areas spatially corresponding to the first and second distinct and separated areas of the micro-wire layer.
4. The method of claim 3 , further including adhering the second area of the protective layer to the first area of the substrate on a side of the substrate opposing the first micro-wires.
5. The method of claim 1 , wherein the another substrate is a display cover or a display substrate.
6. The method of claim 1 , further including locating a first alignment mark on the first area of the substrate or the first area of the micro-wire layer.
7. The method of claim 1 , further including locating a second alignment mark on the second area of the substrate or the second area of the micro-wire layer.
8. The method of claim 1 , further including aligning the first area of the substrate or the first area of the micro-wire layer with the second area of the substrate or the second area of the micro-wire layer.
9. The method of claim 1 , further including separating the first area from the second area by cutting.
10. The method of claim 1 , further including providing the micro-wire layer by printing and locating the first and second micro-wires in a common step.
11. The method of claim 1 , further including providing the micro-wire layer as an uncured layer, imprinting micro-channels in the uncured layer, curing the uncured layer to form a cured layer with imprinted micro-channels, coating the cured layer and imprinted micro-channels with a conductive ink, removing the conductive ink from the cured layer and not the imprinted micro-channels, and curing the conductive ink to provide micro-wires in the imprinted micro-channels.
12. The method of claim 1 , further including locating the first connection pads along an edge of the first area or locating the second connection pads along an edge of the second area.
13. The method of claim 1 , further including locating a first alignment mark along an edge of the first area or locating a second alignment mark along an edge of the second area.
14. The method of claim 1 , further including forming a first alignment mark and the first micro-wires in a common step with common materials in the first area or forming a second alignment mark and the second micro-wires in a common step with common materials in the second area.
15. The method of claim 1 , further including forming the first connection pads and the first micro-wires in a common step with common materials in the first area or forming the second connection pads and the second micro-wires in a common step with common materials in the second area.