MULTI-AREA MICRO-WIRE STRUCTURE
A multi-area micro-wire structure includes a substrate and a micro-wire layer having first and second distinct and separated areas and first and second layer edges, respectively. The second layer edge is different from the first layer edge and the second area is larger than the first area. One or more first micro-wire electrodes and one or more first connection pads are located in the micro-wire layer in the first area. One or more second micro-wire electrodes and one or more second connection pads are located in the micro-wire layer in the second area. Each micro-wire electrode includes one or more electrically connected micro-wires. Each first or second connection pad is located adjacent to the first or second layer edge and electrically connected to a corresponding first or second micro-wire electrode, respectively.
1 . A multi-area micro-wire structure, comprising:
a substrate and a micro-wire layer in contact with the substrate, the substrate and micro-wire layer having corresponding first and second distinct and separated areas, the first area having a first layer edge and the second area having a second layer edge different from the first layer edge, and the second area being larger than the first area;
one or more first micro-wire electrodes and one or more exposed first connection pads located in the micro-wire layer in the first area, each first micro-wire electrode including one or more electrically connected first micro-wires, and each first connection pad located adjacent to the first layer edge and electrically connected to a corresponding first micro-wire electrode; and
one or more second micro-wire electrodes and one or more exposed second connection pads located in the micro-wire layer in the second area, each second micro-wire electrode including one or more electrically connected second micro-wires, and each second connection pad located adjacent to the second layer edge and electrically connected to a corresponding second micro-wire electrode.
2 . The multi-area micro-wire structure of claim 1 , wherein the second micro-wires are located between the first connection pads and the second connection pads.
3 . The multi-area micro-wire structure of claim 1 , wherein the first micro-wires and the second micro-wires are located between the first connection pads and the second connection pads.
4 . The multi-area micro-wire structure of claim 1 , wherein the first connection pads and the second connection pads are located between the first micro-wires and the second micro-wires.
5 . The multi-area micro-wire structure of claim 1 , wherein the first micro-wires are arranged in a first pattern and the second micro-wires are arranged in a second pattern matching the first pattern, the substrate has a surface, and wherein the second pattern is spatially out of phase with the first pattern in a direction parallel to the substrate surface.
6 . The multi-area micro-wire structure of claim 1 , further including a protective layer, the first and second micro-wires between the substrate and the protective layer.
7 . The multi-area micro-wire structure of claim 6 , wherein the protective layer has thickness equal to or greater than a thickness of the substrate.
8 . The multi-area micro-wire structure of claim 1 , wherein the first and second connection pads are arranged in rows.
9 . The multi-area micro-wire structure of claim 1 , wherein the row of first connection pads is orthogonal to the row of second connection pads.
10 . The multi-area micro-wire structure of claim 1 , wherein the row of first connection pads is parallel to the row of second connection pads.
11 . The multi-area micro-wire structure of claim 1 , wherein the first micro-wires and the second micro-wires include common materials.
12 . The multi-area micro-wire structure of claim 1 , wherein the first micro-wires are located in micro-channels formed in the first area of the micro-wire layer or the second micro-wires are located in micro-channels formed in the second area of the micro-wire layer.
13 . The multi-area micro-wire structure of claim 1 , wherein the first micro-wires are located on the first layer or form the first layer or the second micro-wires are located on the second layer or form the second layer.
14 . The multi-area micro-wire structure of claim 1 , wherein the first layer or the second layer is a cured layer.
15 . The multi-area micro-wire structure of claim 1 , wherein the first micro-wires or the second micro-wires are cured micro-wires having sintered conductive particles, are plated micro-wires plated on a seed layer, are silver halide micro-wires, or are dried conductive ink micro-wires.
16 . The multi-area micro-wire structure of claim 1 , wherein the micro-wire layer further includes a spacing area between the first area and the second area.
17 . The multi-area micro-wire structure of claim 16 , further including a cut line located in the spacing area.
18 . The multi-area micro-wire structure of claim 16 , wherein the substrate is folded in the spacing area so that the substrate is between the first area and second area of the micro-wire layer.
19 . The multi-area micro-wire structure of claim 1 , wherein the first micro-wires are sense micro-wires and the second micro-wires are drive micro-wires or wherein the second micro-wires are sense micro-wires and the first micro-wires are drive micro-wires.
20 . A capacitive touch screen having the multi-area micro-wire structure of claim 19 .