Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits
View Patent ↗A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.
1. An arrangement for providing an electrical connection between a first device and a second device for communicating a complementary-encoded data signal therebetween, defined as a DATA signal component and a DATA signal component, the arrangement comprising:
an array of parallel signal paths disposed between the first device and the second device, the array including:
a first set of signal paths for carrying the DATA signal component; and
a second set of signal paths for carrying the DATA signal component,
wherein the signal paths forming the first set and the second set are interleaved such that oppositely-signed signals are carried on adjacent signal paths.
2. The arrangement as defined in claim 1 wherein the array of parallel signal paths comprises an array of wirebonds formed between the first device and a plurality of separate bondpads on the second device, wherein the wirebonds forming the first set are disposed in an interleaved configuration with the wirebonds forming the second set.
3. The arrangement as defined in claim 1 wherein the array of parallel signal paths comprises an array of conductive traces formed within the second device, a first set of conductive traces coupled to receive the DATA signal component from the first device and a second set of conductive traces coupled to receive the DATA signal component from the first device, the first set of conductive traces interleaved with the second set of conductive traces to form a low inductance array connection.
4. The arrangement as defined in claim 1 wherein the array of parallel signal paths comprises:
an array of wirebonds formed between the first device and a plurality of separate bondpads on the second device, wherein the wirebonds forming the first set are disposed in an interleaved configuration with the wirebonds forming the second set; and
an array of conductive traces coupled between the plurality of separate bondpads and a predetermined location on the second device, wherein the first set of conductive traces are interleaved with the second set of conductive traces to form a low inductance array connection.
5. The arrangement as defined in claim 1 , further comprising an optical modulator within the second device, the DATA and DATA signal components applied as separate inputs to the optical modulator.
6. The arrangement as defined in claim 5 wherein the optical modulator comprises a multi-segment optical modulator with each modulator arm including a plurality of separate modulating sections, each modulating section responsive to a separate low inductance connection in the form of the array of separate signal paths.
7. An arrangement for providing an electrical connection between a first substrate and a second substrate for communicating a complementary-encoded data signal therebetween, defined as a DATA signal component and a DATA signal component, the arrangement comprising:
an array of parallel signal paths disposed between the first substrate and the second substrate, the array including:
a first set of signal paths for carrying the DATA signal component; and
a second set of signal paths for carrying the DATA signal component,
wherein the signal paths forming the first set and the second set are interleaved such that oppositely-signed signals are carried on adjacent signal paths.
8. The arrangement as defined in claim 7 wherein the array of parallel signal paths comprises an array of wirebonds formed between the first substrate and a plurality of separate bondpads on the second substrate, wherein the wirebonds forming the first set are disposed in an interleaved configuration with the wirebonds forming the second set.
9. The arrangement as defined in claim 7 wherein the array of parallel signal paths comprises an array of conductive traces formed within the second substrate, a first set of conductive traces coupled to receive the DATA signal component from the first substrate and a second set of conductive traces coupled to receive the DATA signal component from the first substrate, the first set of conductive traces interleaved with the second set of conductive traces to form a low inductance array connection.
10. The arrangement as defined in claim 7 wherein the array of parallel signal paths comprises:
an array of wirebonds formed between the first substrate and a plurality of separate bondpads on the second substrate, wherein the wirebonds forming the first set are disposed in an interleaved configuration with the wirebonds forming the second set; and
an array of conductive traces coupled between the plurality of separate bondpads and a predetermined location on the second substrate, wherein the first set of conductive traces are interleaved with the second set of conductive traces to form a low inductance array connection.
11. The arrangement as defined in claim 7 , further comprising an optical modulator within the second substrate, the DATA and DATA signal components applied as separate inputs to the optical modulator.
12. The arrangement as defined in claim 11 wherein the optical modulator comprises a multi-segment optical modulator with each modulator arm including a plurality of separate modulating sections, each modulating section responsive to a separate low inductance connection in the form of the array of separate signal paths.
13. An electrical connection for communicating a complementary-encoded data signal defined as a DATA signal component and a DATA signal component between first and second ends of the electrical connection, the electrical connection comprising:
an array of parallel signal paths disposed between the first and second ends, the array including:
a first set of signal paths for carrying the DATA signal component; and
a second set of signal paths for carrying the DATA signal component,
wherein the signal paths forming the first set and the second set are interleaved such that oppositely-signed signals are carried on adjacent signal paths.
14. The electrical connection of claim 13 wherein the array of parallel signal paths comprises an array of wirebonds, wherein the wirebonds forming the first set are disposed in an interleaved configuration with the wirebonds forming the second set.
15. The electrical connection of claim 13 wherein the array of parallel signal paths comprises an array of conductive traces formed within a device, a first set of conductive traces coupled to receive the DATA signal component and a second set of conductive traces coupled to receive the DATA signal component, the first set of conductive traces interleaved with the second set of conductive traces to form a low inductance array connection.
16. The electrical connection of claim 13 wherein the array of parallel signal paths comprises:
an array of wirebonds coupled to separate bondpads on a device, wherein the wirebonds forming the first set are disposed in an interleaved configuration with the wirebonds forming the second set; and
an array of conductive traces coupled between the plurality of separate bondpads and a predetermined location on the device, wherein the first set of conductive traces are interleaved with the second set of conductive traces to form a low inductance array connection.