Thermal stand-off with tortuous solid-wall thermal conduction path
View Patent ↗A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.
1. A thermal stand-off comprising:
a rigid thermal stand-off section within a spatial region extending along a distance between a first location and second, opposed location,
the rigid thermal stand-off section including a tortuous solid-wall thermal conduction path extending from the first location to the second location,
the tortuous solid-wall thermal conduction path being longer than the distance of the spatial region,
wherein the tortuous solid-wall thermal conduction path includes an antegrade section and, relative the antegrade section, a retrograde section,
wherein the antegrade section and the retrograde section provide a back turn with respect to a reference start location at the first location and a reference end location at the second location
a sleeve extending around the rigid thermal stand-off section, the sleeve extending from one side of the rigid thermal stand-off section at least partially over the length.
2. A thermal stand-off comprising:
a rigid thermal stand-off section within a spatial region extending along a distance between a first location and second, opposed location,
the rigid thermal stand-off section including a tortuous solid-wall thermal conduction path extending from the first location to the second location,
the tortuous solid-wall thermal conduction path being longer than the distance of the spatial region,
wherein the tortuous solid-wall thermal conduction path includes an antegrade section and, relative the antegrade section, a retrograde section,
wherein the antegrade section and the retrograde section provide a back turn with respect to a reference start location at the first location and a reference end location at the second location
a sleeve extending around the rigid thermal stand-off section and partially over the length, the sleeve extending from a connected base at the one side of the rigid thermal stand-off section to a free end distal from the one side of the rigid thermal stand-off section.