Optoelectronic semiconductor device and the manufacturing method thereof
View Patent ↗The present application provides a method of manufacturing an optoelectronic semiconductor device, comprising the steps of: providing a substrate; forming an optoelectronic system on the substrate; forming a barrier layer on the optoelectronic system; forming an electrode on the barrier layer; and annealing the optoelectronic semiconductor device; wherein the optoelectronic semiconductor device has a first forward voltage before the annealing step and has a second forward voltage after the annealing step, and a difference between the second forward voltage and the first forward voltage is smaller than 0.2 Volt.
1. A method of manufacturing an optoelectronic semiconductor device, comprising the steps of:
providing a substrate;
forming an optoelectronic system on the substrate;
forming a barrier layer on the optoelectronic system;
forming an electrode on the barrier layer; and
annealing the optoelectronic semiconductor device;
wherein the optoelectronic semiconductor device has a first forward voltage before the annealing step and has a second forward voltage after the annealing step, and a difference between the second forward voltage and the first forward voltage is smaller than 0.2 Volt.
2. The method according to claim 1 , further comprising a step of patterning the optoelectronic system to form a sidewall.
3. The method according to claim 2 , wherein the method of forming the barrier layer comprises physical vapor phase deposition (PVD).
4. The method according to claim 3 , wherein the physical vapor phase deposition (PVD) comprises sputtering deposition.
5. The method according to claim 2 , further comprising a step of forming a passivation layer on a sidewall of the optoelectronic system.
6. The method device according to claim 5 , wherein the material of the passivation layer comprises single metal oxides, complex oxides, or non-conductive compound nitrides.
7. The method according to claim 6 , wherein the material of the passivation layer comprises SiN x .
8. The method according to claim 1 , wherein the material of the barrier layer comprises metal nitride.
9. The method according to claim 8 , wherein the material of the barrier layer comprises TiN x .
10. The method according to claim 1 , wherein the optoelectronic system comprises a first conductivity type layer, a conversion unit, and a second conductivity type layer.
11. The method according to claim 1 , wherein the material of the optoelectronic system comprises one or more elements selected from the group consisting of Ga, Al, In, As, P, N, and Si.
12. The method according to claim 1 , wherein the step of annealing the optoelectronic semiconductor device is performed at an annealing temperature greater than 150° C.
13. The method according to claim 1 , comprising cycling the annealing step more than one time.
14. The method according to claim 1 , wherein the first forward voltage and the second forward voltage are measured under a current of 350 mA applied to the optoelectronic semiconductor device.
15. The method according to claim 1 , wherein the second forward voltage is lower than the first forward voltage.
16. The method according to claim 1 , wherein the thickness of the barrier layer is not less than 10 angstroms.
17. The method according to claim 1 , wherein the substrate is conductive.