IP Library Granted Patent US 9,312,461
Granted Patent B2
US 9,312,461 · App. 14/223,263 · Granted Apr 12, 2016

Light-emission element assembly and method of manufacturing same, as well as display

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,312,461
App. No.
14/223,263
Granted
Apr 12, 2016
Kind
B2
Abstract

A light-emission element assembly includes: a light-emission element; a mold section in which the light-emission element is molded; a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided.

Claims (51)

1. A light-emission element assembly comprising:

a light-emission element;

a mold section in which the light-emission element is molded;

a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and

a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided,

wherein the reinforcement section protrudes from the pad section to the mold section.

2. The light-emission element assembly according to claim 1 , wherein the reinforcement section is configured by a metal layer.

3. The light-emission element assembly according to claim 2 , wherein the metal layer is provided to extend on the pad section.

4. The light-emission element assembly according to claim 1 , wherein the reinforcement section projects towards the mold section.

5. The light-emission element assembly according to claim 1 , wherein the pad section protrudes at least from four corners of the undersurface of the mold section.

6. A light-emission element assembly comprising:

a light-emission element;

a mold section in which the light-emission element is molded;

a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and

a reinforcement section configured of a mold-section extended section extended from the mold section, and provided on the pad section,

wherein the reinforcement section protrudes from the pad section to old section.

7. A display comprising

a plurality of light-emission element assemblies arranged in a two-dimensional matrix, one or more of the plurality of light-emission element assemblies each including

a light-emission element,

a mold section in which the light-emission element is molded,

a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element, and

a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided,

wherein the reinforcement section protrudes from the pad section to the mold section.

8. A display comprising

a plurality of light-emission element assemblies arranged in a two-dimensional matrix, one or more of the plurality of light-emission element assemblies each including

a light-emission element,

a mold section in which the light-emission element is molded,

a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element, and

a reinforcement section configured of a mold-section extended section extended from the mold section, and provided on the pad section,

wherein the reinforcement section protrudes from the pad section to the mold section.

9. A method of manufacturing a light-emission element assembly, the method comprising:

preparing a light-emission element assembly, the light-emission element assembly including

a light-emission element,

a mold section in which the light-emission element is molded, and

a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and

forming a reinforcement section, by forming a projection section in the pad section and then forming a metal layer on the pad section and the projection section, the reinforcement section being provided in the pad section, and being configured by the metal layer projecting towards a side on which the mold section is provided,

wherein the reinforcement section protrudes from the pad section to the mold section.

10. The method of manufacturing the light-emission element assembly according to claim 9 , wherein the metal layer is formed by one of:

formation of a primary layer and a plating method of the metal layer on the primary layer;

a lift-off method; and

a combination of any of physical vapor deposition and chemical vapor deposition with an etching technique.

11. The method of manufacturing the light-emission element assembly according to claim 9 , wherein the metal layer is provided to extend on the pad section.

12. The method of manufacturing the light-emission element assembly according to claim 9 , wherein the reinforcement section projects towards the mold section.

13. The method of manufacturing the light-emission element assembly according to claim 9 , wherein the pad section protrudes at least from four corners of the undersurface of the mold section.

14. A method of manufacturing a light-emission element assembly, the method comprising:

preparing a light-emission element assembly, the light-emission element assembly including

a light-emission element,

a mold section in which the light-emission element is molded, and

a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and

forming, on the pad section, a reinforcement section configured of a mold-section extended section extended from the mold section,

wherein the reinforcement section protrudes from the pad section to the mold section.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2014
From: HIRAO, NAOKI; HOSONO, HIROYUKI
To: SONY CORPORATION
Reel/Frame 032508/0624 →