Devices for slag removal

1. A system for removal of slag during laser cutting of a hypotube by a laser cutting system, the system comprising:

a laser nozzle configured to flow gas onto an external surface of a hypotube during laser cutting, a gas cooling system, a water inlet regulator; and a slag collecting device,

wherein the gas cooling system comprises:

a gas supply;

a connection member fluidly coupling the gas supply and the laser nozzle; and

a gas inflow valve positioned along the connection member, wherein the gas inflow valve is configured to regulate the gas that flows into the laser nozzle from the gas supply through the connection member, and

wherein the water inlet regulator comprises:

a source of water;

a plurality of water injection tubes coupled to the source of water and configured to be coupled to an end of the hypotube, the plurality of water injection tubes arranged in series, with a diameter of each successive water injection tube being smaller than the preceding water injection tube;

a pressure valve configured to flow water through the plurality of water injection tubes; and

a water inlet gate configured to inject the water into an inner lumen of the hypotube at a velocity configured to facilitate removal of slag generated during the laser cutting of the hypotube, wherein the external water inlet regulator is configured to cool the hypotube during laser cutting, and

wherein the slag collecting device is configured to collect the removed slag.

2. The system of claim 1 , wherein the gas comprises ambient air.

3. The system of claim 1 , wherein the gas comprises inert gas.

4. The system of claim 1 , wherein the gas has a temperature between 20° C. and 25° C.

5. The system of claim 1 , wherein the plurality of water injection tubes consists essentially of:

a first water injection tube coupled to the source of water;

a second water injection tube;

a third water injection tube, the second water injection tube between the first water injection tube and the third water injection tube; and

a fourth water injection tube configured to be proximate to the end of the hypotube, the third water injection tube between the second water injection tube and the fourth water injection tube.

6. The system of claim 5 , wherein the first water injection tube has a first diameter, the second water injection tube has a second diameter, the third water injection tube has a third diameter, and the fourth injection tube has a fourth diameter, and wherein the fourth diameter is less than the third diameter, the third diameter is less than the second diameter, and the second diameter is less than the first diameter.

7. A system for removal of slag during laser cutting of a hypotube by a laser cutting system, the system comprising:

a laser nozzle configured to flow gas onto an external surface of a hypotube during laser cutting, a cooling system, and a fluid inlet regulator,

wherein the cooling system includes:

a supply of gas;

a connection member fluidly coupling the supply of gas and the laser nozzle; and

a gas inflow valve positioned along the connection member, wherein the gas inflow valve is configured to regulate the gas that flows into the laser nozzle from the supply of gas through the connection member, and

wherein the fluid inlet regulator includes:

a source of fluid;

a fluid injection tube coupled to the source of fluid and configured to be coupled to an end of the hypotube, the fluid injection tube comprising a plurality of fluid injection tubes arranged in series, with a diameter of each successive fluid injection tube being smaller than the preceding fluid injection tube;

a pressure valve configured to flow fluid through the fluid injection tube; and

an inlet gate configured to inject the fluid into an inner lumen of the hypotube at a velocity configured to facilitate removal of slag generated during the laser cutting of the hypotube.

8. The system of claim 7 , wherein the fluid comprises ethylene glycol.

9. The system of claim 7 , wherein the fluid comprises slurry.

10. The system of claim 7 , wherein the fluid comprises water.

11. The system of claim 7 , wherein the gas comprises ambient air.

12. The system of claim 7 , wherein the gas comprises inert gas.

13. The system of claim 7 , wherein the gas has a temperature between 20° C. and 25° C.

14. A system for removal of slag during laser cutting of a hypotube by a laser cutting system, the system comprising:

a cooling system configured to be coupled to a laser nozzle of a laser cutting system, the cooling system including a supply of gas and a gas inflow valve configured to regulate the gas that flows into the laser nozzle from the supply of gas; and

a cooling fluid inlet regulator configured to inject cooling fluid into an inner lumen of a hypotube during laser cutting by the laser cutting system at a velocity configured to facilitate removal of slag generated during the laser cutting of the hypotube, and wherein the cooling fluid inlet regulator is configured to cool the hypotube during the laser cutting, the cooling fluid inlet regulator comprising a plurality of injection tubes arranged in series, with a diameter of each successive injection tube being smaller than the preceding injection tube.

15. The system of claim 14 , wherein the gas comprises ambient air.

16. The system of claim 14 , wherein the gas comprises inert gas.

17. The system of claim 14 , wherein the gas has a temperature between 20° C. and 25° C.

18. The system of claim 14 , wherein the cooling fluid comprises water.