Nanopore-based sequencing chips using stacked wafer technology
A nanopore based sequencing chip is disclosed. The sequencing chip comprises a first portion made from a first wafer. The first portion includes an array of nanopore cells. The first portion further includes a measurement circuit connected to one or more nanopore cells, the measurement circuit producing an output measurement signal. The first portion further includes one or more vias transmitting the output measurement signal. The sequencing chip further includes a second portion made from a second wafer, the second portion comprising one or more corresponding vias receiving the output measurement signal.
1. A nanopore based sequencing chip, comprising:
a first portion made from a first wafer, the first portion comprising:
an array of nanopore cells;
a measurement circuit connected to one or more nanopore cells, the measurement circuit producing an output measurement signal corresponding to the one or more nanopore cells; and
one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells; and
one or more vias receiving control signal for controlling the one or more nanopore cells; and
a second portion made from a second wafer, wherein the first wafer and the second wafer are stacked vertically on top of one another within the same nanopore based sequencing chip wherein the first portion made from the first wafer includes only analog components and wherein the second portion made from the second wafer includes only digital components and wherein the second portion comprising:
one or more vias receiving the output measurement signal corresponding to the one or more nanopore cells transmitted from the one or more vias in the first portion made from the first wafer;
a module generating the control signal in response to a detected event based on the output measurement signal corresponding to the one or more nanopore cells that is transmitted from the one or more vias in the first portion made from the first wafer; and
one or more vias transmitting the control signal to the one or more vias in the first portion made from the first wafer that is receiving the control signal for controlling the one or more nanopore cells, such that the control signal is further routed by a circuitry in the first portion made from the first wafer to the one or more nanopore cells.
2. The nanopore based sequencing chip of claim 1 , wherein the one or more vias transmitting the output measurement signal, the one or more vias receiving the control signal, the one or more vias receiving the output measurement signal, and the one or more vias transmitting the control signal are located at the periphery of the nanopore based sequencing chip.
3. The nanopore based sequencing chip of claim 1 , wherein the one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells in the first portion made from the first wafer are located within a single nanopore cell.
4. The nanopore based sequencing chip of claim 1 , wherein the one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells in the first portion made from the first wafer are located within a group of nanopore cells that share one or more components located in the second portion made from the second wafer, and wherein the one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells in the first portion made from the first wafer transmit the output measurement signal to the one or more shared components in the second portion made from the second wafer.
5. The nanopore based sequencing chip of claim 1 , wherein the second portion made from the second wafer further comprises a module compressing the output measurement signal corresponding to the one or more nanopore cells in the first portion made from the first wafer.
6. The nanopore based sequencing chip of claim 1 , wherein the first portion made from the first wafer further comprises an analog-to-digital converter (ADC) converting the output measurement signal to a digital version of the output measurement signal prior to the transmission of the digital version of the output measurement signal by the one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells in the first portion made from the first wafer.
7. A method of performing nucleotide sequencing by a nanopore based sequencing chip, comprising:
partitioning the nanopore based sequencing chip into a first portion made from a first wafer, the first portion comprising:
an array of nanopore cells;
a measurement circuit connected to one or more nanopore cells, the measurement circuit producing an output measurement signal corresponding to the one or more nanopore cells; and
one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells; and
one or more vias receiving control signal for controlling the one or more nanopore cells; and
partitioning the nanopore based sequencing chip into a second portion made from a second wafer, wherein the first wafer and the second wafer are stacked vertically on top of one another within the same nanopore based sequencing chip wherein the first portion made from the first wafer includes only analog components and wherein the second portion made from the second wafer includes only digital components and wherein the second portion comprising:
one or more vias receiving the output measurement signal corresponding to the one or more nanopore cells transmitted from the one or more vias in the first portion made from the first wafer;
a module generating the control signal in response to a detected event based on the output measurement signal corresponding to the one or more nanopore cells transmitted from the one or more vias in the first portion made from the first wafer; and
one or more vias transmitting the control signal to the one or more vias in the first portion made from the first wafer receiving the control signal for controlling the one or more nanopore cells, such that the control signal is further routed by a circuitry in the first portion made from the first wafer to the one or more nanopore cells.
8. The method of claim 7 , wherein the one or more vias transmitting the output measurement signal, the one or more vias receiving the control signal, the one or more vias receiving the output measurement signal, and the one or more vias transmitting the control signal are located at the periphery of the nanopore based sequencing chip.
9. The method of claim 7 , wherein the one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells in the first portion made from the first wafer are located within a single nanopore cell.
10. The method of claim 7 , wherein the one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells in the first portion made from first wafer are located within a group of nanopore cells that share one or more components located in the second portion made from the second wafer, and wherein the one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells in the first portion of the first wafer transmit the output measurement signal to the one or more shared components on the second portion made from the second wafer.
11. The method of claim 7 , wherein the second portion made from the second wafer further comprises a module compressing the output measurement signal corresponding to the one or more nanopore cells in the first portion made from the first wafer.
12. The method of claim 7 , wherein the first portion made from the first wafer further comprises an analog-to-digital converter (ADC) converting the output measurement signal to a digital version of the output measurement signal prior to the transmission of the digital version of the output measurement signal by the one or more vias transmitting the output measurement signal corresponding to the one or more nanopore cells in the first portion made from the first wafer.