Piezo vibration module

1. A piezo vibration module, comprising:

a piezo element having a pattern of an internal electrode printed therein and having an external electrode connected to the internal electrode and disposed on an outer surface thereof;

a flexible printed circuit board (FPCB) having each terminal and applying power to the external electrode of the piezo element; and

a conductive adhesive interposed between the piezo element and the FPCB to electrically connect the piezo element to the FPCB,

wherein the conductive adhesive further includes a filler selected from a group consisting of epoxy, silver (Ag), and a combination thereof.

2. The piezo vibration module as set forth in claim 1 , wherein the conductive adhesive is interposed between the external electrode of the piezo element and the terminal.

3. The piezo vibration module as set forth in claim 1 , wherein the conductive adhesive is formed in a thin film conductive tape form.

4. The piezo vibration module as set forth in claim 1 , wherein the conductive adhesive is formed of a thermal evaporation tape.

5. The piezo vibration module as set forth in claim 1 , further comprising:

an upper case having an opened lower surface and having an inner space formed therein;

a lower case coupled with a lower surface of the upper case to shield the inner space of the upper case; and

a vibration plate including a flat lower plate mounted with the piezo element and a pair of upper plates vertically upward standing at a center of both sides of the lower plate and disposed in the upper case and the lower case to be vertically driven,

wherein the piezo element suffers from a repetitive expansion and contraction deformation depending on application of external power to generate a vibration force, and

one end of the FPCB is attached to the piezo element by the conductive adhesive and the other end thereof is drawn to an outside of the piezo vibration module.

6. The piezo vibration module as set forth in claim 5 , wherein the vibration plate includes a weight body additionally disposed between the pair of upper plates in order to increase the vibration force of the piezo element.

7. The piezo vibration module as set forth in claim 5 , wherein the lower case and the lower plate are spaced apart from each other at a predetermined interval.

8. The piezo vibration module as set forth in claim 5 , further comprising:

a first buffer member disposed between the vibration plate and the upper case.

9. The piezo vibration module as set forth in claim 5 , further comprising:

a third buffer member disposed between the vibration plate and the lower case.

10. The piezo vibration module as set forth in claim 6 , further comprising:

a second buffer member disposed at both sides of a lower portion of the weight body.

11. The piezo vibration module as set forth in claim 5 , wherein the lower case includes a coupling portion vertically upward protruding at both ends thereof.

12. The piezo vibration module as set forth in claim 11 , wherein the coupling portion forms a guide groove.