Reflective mask blank for EUV lithography and process for its production
View Patent ↗To provide a process for producing an EUV mask blank, whereby the deformation of a substrate due to film stress in a Mo/Si multilayer reflective film can be reduced, and the change with time of the film stress in the Mo/Si multilayer reflective film can be reduced. A process for producing a reflective mask blank for EUVL, which comprises forming a multilayer reflective film for reflecting EUV light on a film-forming surface of a substrate, then forming an absorber layer for absorbing EUV light, on the multilayer reflective film, to produce a reflective mask blank for EUV lithography, wherein the multilayer reflective film is a Mo/Si multilayer reflective film, the uppermost layer of the multilayer reflective film is a Si film, and after forming the absorber layer, the substrate on which the absorber layer is formed is subjected to heating treatment at a temperature of from 110 to 170° C.
1. A process for producing a reflective mask blank for EUV lithography, which comprises forming a multilayer reflective film for reflecting EUV light on a film-forming surface of a substrate, then forming an absorber layer for absorbing EUV light, on the multilayer reflective film, to produce a reflective mask blank for EUV lithography, wherein the multilayer reflective film is a Mo/Si multilayer reflective film, the uppermost layer of the multilayer reflective film is a Si film, and after forming the absorber layer, the substrate on which the absorber layer is formed is subjected to heating treatment at a temperature of from 110 to 170° C.
2. The process for producing a reflective mask blank for EUV lithography according to claim 1 , wherein after forming the absorber layer, the substrate on which the absorber layer is formed is subjected to heating treatment at a temperature of from 120 to 160° C.
3. The process for producing a reflective mask blank for EUV lithography according to claim 1 , wherein after forming the multilayer reflective film, a protective layer for protecting the multilayer reflective film, is formed on the multilayer reflective film, the absorber layer is formed on the protective layer, and after forming the absorber layer, the substrate on which the absorber layer is formed is subjected to heating treatment.
4. The process for producing a reflective mask blank for EUV lithography according to claim 3 , wherein the protective layer is a Ru layer or a Ru compound layer.
5. The process for producing a reflective mask blank for EUV lithography according to claim 1 , wherein the heating treatment is carried out in the atmospheric air.
6. The process for producing a reflective mask blank for EUV lithography according to claim 1 , wherein the absorber layer is a layer containing tantalum (Ta) and nitrogen (N) at the total content of at least 60 at %, and the absorber layer has a film thickness of from 5 to 100 nm.
7. The process for producing a reflective mask blank for EUV lithography according to claim 1 , wherein the heating treatment is carried out to form a surface oxide film on the absorber layer.
8. A process for producing a reflective mask blank for EUV lithography, which comprises forming a multilayer reflective film for reflecting EUV light on a film-forming surface of a substrate, then forming an absorber layer for absorbing EUV light, on the multilayer reflective film, and forming a low reflective layer for an inspection light to be used for inspection of a mask pattern, on the absorber layer, to produce a reflective mask blank for EUV lithography, wherein the multilayer reflective film is a Mo/Si multilayer reflective film, the uppermost layer of the multilayer reflective film is a Si film, and after forming the low reflective layer, the substrate on which the low reflective layer is formed is subjected to heating treatment at a temperature of from 110 to 170° C.
9. The process for producing a reflective mask blank for EUV lithography according to claim 8 , wherein after forming the low reflective layer, the substrate on which the low reflective layer is formed is subjected to heating treatment at a temperature of from 120 to 160° C.
10. The process for producing a reflective mask blank for EUV lithography according to claim 8 , wherein after forming the multilayer reflective film, a protective layer for protecting the multilayer reflective film, is formed on the multilayer reflective film, the absorber layer is formed on the protective layer, the low reflective layer is formed on the absorber layer, and after forming the low reflective layer, the substrate on which the low reflective layer is formed is subjected to the heating treatment.
11. The process for producing a reflective mask blank for EUV lithography according to claim 10 , wherein the protective layer is a Ru layer or a Ru compound layer.
12. The process for producing a reflective mask blank for EUV lithography according to claim 8 , wherein the heating treatment is carried out in the atmospheric air.
13. The process for producing a reflective mask blank for EUV lithography according to claim 8 , wherein the absorber layer is a layer containing tantalum (Ta) and nitrogen (N) at the total content of at least 60 at %, and the absorber layer has a film thickness of from 5 to 100 nm.
14. The process for producing a reflective mask blank for EUV lithography according to claim 8 , wherein the low reflective layer is a layer containing tantalum (Ta), oxygen (O) and nitrogen (N) at the total content of at least 60 at %, and the low reflective layer has a film thickness of from 1 to 30 nm.
15. The process for producing a reflective mask blank for EUV lithography according to claim 8 , wherein the heating treatment is carried out to form a surface oxide film on the low reflective layer.
16. A reflective mask blank for EUV lithography, which is obtained by the process for producing a reflective mask blank for EUV lithography as defined in claim 7 and has the surface oxide film having a film thickness of from 0.5 to 3 nm on the absorber layer.
17. A reflective mask blank for EUV lithography, which is obtained by the process for producing a reflective mask blank for EUV lithography as defined in claim 15 and has the surface oxide film having a film thickness of from 0.5 to 3 nm on the low reflective layer.