Laser machining strengthened glass
View Patent ↗An internal feature can be laser machined in strengthened glass sheets or panels by first laser machining a first scribe in a first surface proximate to the internal feature to be laser machined. The internal feature can be then laser machined by positioning a beam waist of a laser beam proximate to an opposite second surface by focusing the laser beam through the strengthened glass panel from the first surface. The internal feature is laser machined by repositioning the beam waist from the second surface to the first surface while removing material from a kerf surrounding the internal feature. When the laser beam waist is finally positioned proximate to the first surface material, the internal shape formed by the laser machining is easily and cleanly removed from the surrounding glass.
1. A method, comprising:
directing a focal spot of a laser to a first position proximate to a first surface of a strengthened glass sheet;
removing material from the strengthened glass sheet along a closed path using the laser while the focal spot is in the first position, thereby forming a groove in the first surface of the strengthened glass sheet extending along the closed path;
after forming the groove, directing the focal spot of the laser to a second position proximate to a second surface of the strengthened glass sheet, the second surface opposite from the first surface; and
forming a kerf by:
removing a layer of material from the strengthened glass substrate at the second surface to form a newly-uncovered surface using the laser while the focal spot is in the second position; and
removing at least one additional layer of material from the strengthened glass sheet starting at the newly-uncovered surface and finishing at the first surface using the laser by repositioning the focal spot a position proximate to each newly-uncovered surface resulting from removing a previous layer;
wherein the kerf intersects the first surface of the strengthened glass sheet in contact with the groove along the closed path.
2. The method of claim 1 wherein the first surface and the second surface and portions of the strengthened glass sheet adjacent to the first surface and the second surface are under compression and an interior portion of the strengthened glass sheet extending between the portions of the strengthened glass sheet proximate to the first surface and the second surface is under tension.
3. The method of claim 2 wherein the groove is confined to a portion of the strengthened glass substrate adjacent to the first surface that is under compression.
4. The method of claim 1 , further comprising:
setting laser parameters of the laser used while forming the kerf such that laser pulses from the laser are transmitted through the strengthened glass sheet.
5. The method of claim 1 , further comprising:
setting laser parameters of the laser such that a laser pulse removes a chip of material from the strengthened glass sheet having a diameter that is approximately equal to a size of the focal spot.
6. The method of claim 5 wherein the laser parameters include laser wavelength, laser power, pulse duration, pulse energy, pulse repetition rate, polarization and scan velocity.
7. The method of claim 1 wherein the first surface is a top surface of the strengthened glass sheet closest to the laser.
8. The method of claim 1 , further comprising:
removing an area of the strengthened glass sheet encompassed by the closed path from a remaining area of the strengthened glass sheet.
9. The method of claim 1 wherein an external edge of the kerf intersects the first surface of the strengthened glass substrate in contact with an external edge of the groove along the closed path, the external edge of the kerf and the external edge of the groove defined relative to a shape formed by the closed path.
10. The method of claim 1 wherein an internal edge of the kerf intersects the first surface of the strengthened glass substrate in contact with an internal edge of the groove along the closed path, the internal edge of the kerf and the internal edge of the groove defined relative to a shape formed by the closed path.
11. The method of claim 1 wherein the closed path forms one of a square having rounded edges, a circle or a notch having rounded edges.
12. An apparatus, comprising:
memory; and
a processor configured to execute instructions stored in the memory to:
direct a focal spot of a laser to a first position proximate to a first surface of a strengthened glass sheet;
remove material from the strengthened glass sheet along a closed path using the laser while the focal spot is in the first position, thereby forming a groove in the first surface of the strengthened glass sheet extending along the closed path;
after formation of the groove, direct the focal spot of the laser to a second position proximate to a second surface of the strengthened glass sheet, the second surface opposite from the first surface; and
form a kerf by:
removing a layer of material from the strengthened glass substrate at the second surface to form a newly-uncovered surface using the laser while the focal spot is in the second position; and
removing at least one additional layer of material from the strengthened glass sheet starting at the newly-uncovered surface and finishing at the first surface using the laser by repositioning the focal spot a position proximate to each newly-uncovered surface resulting from removing a previous layer;
wherein the kerf intersects the first surface of the strengthened glass sheet in contact with the groove along the closed path.
13. The apparatus of claim 12 wherein a depth of the groove is limited to a depth of an outer surface of the strengthened glass sheet adjacent to the first surface that is under compression so that the groove does not contact an interior portion of the strengthened glass sheet that this under tension.
14. The apparatus of claim 12 wherein the processor is configured to:
set laser parameters of the laser used while forming the kerf such that laser pulses from the laser are transmitted through the strengthened glass sheet.
15. The apparatus of claim 12 wherein the processor is configured to:
set laser parameters of the laser such that a laser pulse removes a chip of material from the strengthened glass sheet, the chip having a diameter that is approximately equal to a size of the focal spot.
16. The apparatus of claim 15 wherein a wavelength of the laser is about 515 nm.
17. The apparatus of claim 12 wherein the closed path forms one of a square having rounded edges, a circle or a notch having rounded edges.
18. The apparatus of claim 12 , further comprising:
the laser;
laser steering optics;
laser field optics; and
at least one motion stage; wherein the laser, the laser steering optics and the at least one motion stage are controlled by the processor to direct laser pulses from the laser through the laser field optics to:
direct the focal spot of the laser to the first position;
remove the material from the strengthened glass sheet along the closed path using the laser while the focal spot is in the first position;
direct the focal spot of the laser to the second position; and
form the kerf.