Reflective diffraction grating and fabrication method

1. A reflective diffraction grating comprising:

a substrate;

an ultraviolet (UV)-absorbing layer disposed over the substrate, and separate from the substrate, for absorbing light at a UV recording wavelength during holographic patterning,

the UV-absorbing layer being:

formed of a UV-absorbing dielectric material having an extinction coefficient of greater than about 0.025 at the UV recording wavelength, and having a thickness greater than 1.2 μm and less than 2 μm;

a grating layer, disposed over the UV-absorbing layer, having a binary surface-relief pattern formed therein, wherein the binary surface-relief pattern includes ridges having rectangular or trapezoidal cross-sections separated by grooves; and

a conforming reflective layer, disposed over the binary surface-relief pattern, forming a grating profile,

the grating profile being associated with profile parameters, and

the UV-absorbing dielectric material and the thickness of the UV-absorbing layer being selected such that particular patterns are suppressed during the holographic patterning.

2. The reflective diffraction grating of claim 1 , wherein the UV-absorbing layer has a thickness of greater than about 1.5 μm.

3. The reflective diffraction grating of claim 1 , wherein the UV-absorbing layer is continuous and unpatterned.

4. The reflective diffraction grating of claim 1 , wherein the UV-absorbing layer is formed of brown tantala.

5. The reflective diffraction grating of claim 1 , wherein the extinction coefficient is greater than about 0.035 at the UV recording wavelength.

6. The reflective diffraction grating of claim 1 , wherein the reflective diffraction grating is fabricated by holographic lithography at the UV recording wavelength, and wherein the UV recording wavelength is in a wavelength range of about 10 nm to about 450 nm.

7. The reflective diffraction grating of claim 1 , wherein the binary surface-relief pattern has a base air-groove width (AGW) about 1.5 times larger than a final AGW of the grating profile.

8. The reflective diffraction grating of claim 1 , wherein the UV-absorbing layer is formed of tantala, wherein the grating layer is formed of silica, and wherein the conforming reflective layer is formed of gold.

9. The reflective diffraction grating of claim 8 , further comprising:

an adhesion layer disposed between the binary surface-relief pattern and the conforming reflective layer, wherein the adhesion layer is formed of titanium.

10. The reflective diffraction grating of claim 9 , further comprising:

a barrier layer disposed between the adhesion layer and the conforming reflective layer, wherein the barrier layer is formed of titanium nitride.

11. A method of fabricating one or more reflective diffraction gratings, the method comprising:

providing a substrate;

depositing an ultraviolet (UV)-absorbing layer over the substrate, and separate from the substrate, for absorbing light at a UV recording wavelength to minimize reflection thereof by the substrate, the UV-absorbing layer being:

formed of a UV-absorbing dielectric material having an extinction coefficient of greater than about 0.025 at the UV recording wavelength, and having a thickness greater than 1.2 μm and less than 2 μm;

depositing a grating layer over the UV-absorbing layer;

applying a photoresist layer over the grating layer;

patterning the photoresist layer by holography at the UV recording wavelength;

etching the grating layer through the patterned photoresist layer to form a binary surface-relief pattern therein, wherein the binary surface-relief pattern includes ridges having rectangular or trapezoidal cross-sections separated by grooves;

removing the patterned photoresist layer; and

depositing a conforming reflective layer over the binary surface-relief pattern to form a grating profile,

the UV-absorbing dielectric material and the thickness of the UV-absorbing layer being selected such that particular patterns are suppressed during holographic patterning.

12. The method of claim 11 , wherein the UV-absorbing layer is deposited to a thickness of greater than about 1.5 μm.

13. The method of claim 11 , wherein the grating layer is etched by etching an upper portion of the grating layer without etching the UV-absorbing layer.

14. The method of claim 11 , wherein the binary surface-relief pattern is formed to have a base air-groove width (AGW), wherein the conforming reflective layer is deposited to a thickness providing the grating profile with a final AGW, and wherein the base AGW is about 1.5 times larger than the final AGW.

15. The method of claim 11 , further comprising:

depositing an adhesion layer over the binary surface-relief pattern, wherein the conforming reflective layer is deposited over the adhesion layer.

16. The method of claim 15 , further comprising:

depositing a barrier layer over the adhesion layer, wherein the conforming reflective layer is deposited over the barrier layer.

17. The method of claim 11 , further comprising:

testing the grating profile by using a wafer-level characterization technique to provide a test result; and

selectively:

reworking the conforming reflective layer if the test result is a fail; or

singulating the substrate to form a plurality of reflective diffraction gratings if the test result is a pass.

18. The method of claim 17 , wherein the substrate is reworked by removing and re-depositing the conforming reflecting layer.

19. The method of claim 17 , wherein the substrate is reworked by continuing deposition of the conforming reflecting layer.

20. The method of claim 17 , wherein testing the grating profile includes measuring at least one of an AGW of the grating profile, a diffraction efficiency of the grating profile, or a diffraction efficiency uniformity of the grating profile.