Solar cell having a plurality of sub-cells coupled by a metallization structure
View Patent ↗Solar cells having a plurality of sub-cells coupled by metallization structures, and singulation approaches to forming solar cells having a plurality of sub-cells coupled by metallization structures, are described. In an example, a solar cell, includes a plurality of sub-cells, each of the sub-cells having a singulated and physically separated semiconductor substrate portion. Adjacent ones of the singulated and physically separated semiconductor substrate portions have a groove there between. The solar cell also includes a monolithic metallization structure. A portion of the monolithic metallization structure couples ones of the plurality of sub-cells. The groove between adjacent ones of the singulated and physically separated semiconductor substrate portions exposes a portion of the monolithic metallization structure.
1. A method of fabricating a solar cell, the method comprising:
forming a metallization structure on a first surface of a semiconductor substrate; and
subsequent to forming the metallization structure, scribing entirely through the semiconductor substrate from a second, opposite, surface of the semiconductor substrate, the scribing stopped by and exposing portions of the metallization structure from the second surface, wherein the scribing comprises forming a plurality of sub-cells, each of the sub-cells comprising a singulated and physically separated portion of the semiconductor substrate having a groove between adjacent ones of the singulated and physically separated semiconductor substrate portions, wherein the metallization structure unifies ones of the plurality of sub-cells.
2. The method of claim 1 , wherein forming the metallization structure on the first surface of the semiconductor substrate comprises patterning a metal foil formed on the first surface of the semiconductor substrate.
3. The method of claim 1 , wherein forming the metallization structure on the first surface of the semiconductor substrate comprises plating one or more metal films on portions of the first surface of the semiconductor substrate.
4. The method of claim 1 , wherein the scribing comprising scribing with a laser.
5. The method of claim 1 , further comprising:
prior to scribing the semiconductor substrate, texturizing the second surface of the semiconductor substrate.
6. The method of claim 1 , further comprising:
forming an encapsulating material in the groove between adjacent ones of the singulated and physically separated semiconductor substrate portions.
7. The method of claim 1 , wherein forming the plurality of sub-cells comprises forming each of the sub-cells to have approximately a same voltage characteristic and approximately a same current characteristic.
8. The solar cell of claim 1 , wherein forming the plurality of sub-cells comprises forming a plurality of in-parallel diodes, in-series diodes, or a combination thereof.
9. The method of claim 1 , further comprising:
subsequent to scribing the semiconductor substrate, embedding the solar cell in a photovoltaic (PV) module laminate, wherein an encapsulating material of the PV module laminate fills the groove between adjacent ones of the singulated and physically separated semiconductor substrate portions.