Fabrication of III-nitride layers
View Patent ↗A method that includes implantation of dopants while a III-nitride body is being grown on a substrate, and an apparatus for the practice of the method.
1. An apparatus comprising:
a reactor chamber to receive a substrate and a reactant gas to grow a III-nitride semiconductor body on said substrate;
an implanter chamber to implant ions into said III-nitride semiconductor body to dope said III-nitride semiconductor body during growth of said III-nitride semiconductor body such that said III-nitride semiconductor body is grown having at least one of N type conductivity and P type conductivity, said implanter chamber being separate from said reactor chamber;
wherein said implanter chamber includes differential pumps.
2. The apparatus of claim 1 , wherein said implanter chamber is in communication with said reactor chamber.
3. The apparatus of claim 1 , wherein said differential pumps are configured to create a near vacuum condition in said implanter chamber.
4. The apparatus of claim 1 , wherein each of said differential pumps is coupled to a respective subchamber of said implanter chamber.
5. The apparatus of claim 1 , wherein said implanter chamber includes a plurality of subchambers in communication with one another.
6. The apparatus of claim 1 , wherein an ion implanter is disposed within said implanter chamber and in communication with said reactor chamber through an ion path.
7. The apparatus of claim 1 , further comprising deflection plates to change a direction of travel of said ions.
8. The apparatus of claim 1 , further comprising a Faraday cup disposed within said reactor chamber.
9. The apparatus of claim 1 , wherein said reactor chamber comprises a rotating platform for receiving said substrate.
10. A method comprising:
placing a substrate in a reactor chamber;
pumping reactant gas into said reactor chamber for growing a III-nitride semiconductor body on said substrate;
implanting ions from an implanter chamber into said III-nitride semiconductor body to dope said III-nitride semiconductor body during growth of said III-nitride semiconductor body such that said III-nitride semiconductor body is grown having at least one of N type conductivity and P type conductivity;
wherein said implanter chamber includes differential pumps.
11. The method of claim 10 , wherein said ions pass through said implanter chamber under a near vacuum prior to reaching said substrate.
12. The method of claim 11 , wherein said near vacuum is obtained using said differential pumps of said implanter chamber.
13. The method of claim 10 , wherein an ion path extends from an ion implanter of said implanter chamber to said reactor chamber.
14. The method of claim 10 , further comprising measuring a dosage of said ions while implanting takes place.
15. The method of claim 14 , wherein said dosage is measured using a Faraday cup.
16. The method of claim 10 , further comprising changing a direction of travel of said ions.
17. The method of claim 16 , wherein deflection plates are used to change said direction of travel of said ions.
18. The method of claim 10 , wherein each of said differential pumps is coupled to a respective subchamber of said implanter chamber.
19. The method of claim 10 , wherein said implanter chamber comprises a plurality of subchambers in communication with one another.
20. The method of claim 10 , wherein said reactor chamber comprises a rotating platform for receiving said substrate.