Solar cells with tunnel dielectrics
View Patent ↗A solar cell can have a first dielectric formed over a first doped region of a silicon substrate. The solar cell can have a second dielectric formed over a second doped region of the silicon substrate, where the first dielectric is a different type of dielectric than the second dielectric. A doped semiconductor can be formed over the first and second dielectric. A positive-type metal and a negative-type metal can be formed over the doped semiconductor.
1. A solar cell, comprising:
a first dielectric formed over a first portion of the silicon substrate;
a second dielectric formed over second portion of the silicon substrate, wherein the first dielectric is a different type of dielectric than the second dielectric;
a doped semiconductor formed over the first and second dielectric;
a positive-type metal contact formed over the doped semiconductor and the first dielectric; and
a negative-type metal contact formed over the doped semiconductor and over the second dielectric.
2. The solar cell of claim 1 , wherein the first dielectric comprises at least an oxide monolayer in contact with the silicon substrate.
3. The solar cell of claim 1 , wherein the second dielectric comprises a plurality of oxide monolayers.
4. The solar cell of claim 1 , wherein the first dielectric comprises silicon nitride.
5. The solar cell of claim 1 , wherein the second dielectric comprises silicon dioxide.
6. The solar cell of claim 1 , wherein the doped semiconductor comprises doped polysilicon.
7. The solar cell of claim 1 , wherein the doped semiconductor comprises a P-type doped polysilicon and an N-type doped polysilicon.
8. The solar cell of claim 7 , wherein the P-type doped polysilicon is formed over the first dielectric and the N-type doped polysilicon is formed over the second dielectric.
9. The solar cell of claim 8 , wherein the silicon substrate comprises a first doped region under the first dielectric and a second doped region under the second dielectric.
10. The solar cell of claim 9 , wherein a dopant concentration ratio between the P-type doped polysilicon and the first doped region is at least 10.
11. The solar cell of claim 1 , wherein the doped semiconductor comprises doped amorphous silicon.
12. A solar cell, comprising:
a first dielectric formed over a first doped region of a silicon substrate;
a second dielectric formed over a second doped region of the silicon substrate, wherein the first dielectric is a different type of dielectric than the second dielectric;
a first doped polysilicon formed over the first dielectric;
a second doped polysilicon formed over the second dielectric;
a positive-type metal contact formed over the first doped polysilicon; and
a negative-type metal contact formed over the second doped polysilicon.
13. The solar cell of claim 12 , wherein the first dielectric comprises at least an oxide monolayer in contact with the silicon substrate.
14. The solar cell of claim 12 , wherein the second dielectric comprises a plurality of oxide monolayers.
15. The solar cell of claim 12 , wherein the first dielectric comprises silicon nitride.
16. The solar cell of claim 12 , wherein the second dielectric comprises silicon dioxide.
17. The solar cell of claim 12 , wherein a dopant concentration ratio between the first doped polysilicon and the first doped region is at least 10.
18. A solar cell, comprising:
silicon nitride formed over a P-type doped region of the silicon substrate;
silicon dioxide formed over an N-type doped region of the silicon substrate;
P-type doped polysilicon formed on the silicon nitride;
N-type doped polysilicon formed on the silicon dioxide;
a positive-type metal contact formed on the P-type doped polysilicon region; and
a negative-type metal contact formed on the N-type doped polysilicon region.
19. The solar cell of claim 18 , wherein a dopant concentration ratio between the P-type doped polysilicon and the P-type doped region is at least 10.
20. The solar cell of claim 18 , wherein the silicon nitride comprises at least an oxide monolayer in contact with the silicon substrate.