System for forming aligned patterns on a substrate
View Patent ↗A system for forming a second pattern in registration with a first pattern on a substrate is disclosed. The system comprises the substrate having a first magnitude of an associated electrical characteristic and at least one alignment structure. The alignment structure has a second magnitude of the electrical characteristic different from that of the substrate. An advancing mechanism is used for moving the substrate. A probe is used for measuring an electrical characteristic at a plurality of positions proximate the moving substrate. A controller is used for interpreting the measured electrical characteristic as a function of position for identifying a location of the alignment structure. A first patterning station is used for forming the second pattern on a surface of the substrate in registration with the first pattern based on the identified location of the alignment structure.
1. A system for forming a second pattern in registration with an alignment structure of a first pattern on a substrate, comprising:
the substrate having a first magnitude of an electrical characteristic associated therewith, the substrate also having the first pattern on a surface of the substrate, the first pattern including at least one alignment structure that is associated with a second magnitude of the electrical characteristic that is different from the first magnitude of the electrical characteristic of the substrate;
an advancing mechanism for moving the substrate;
a probe for measuring an electrical characteristic at a plurality of positions at or near the alignment structure on the moving substrate;
a controller for interpreting the measured electrical characteristic as a function of position for identifying a location of the alignment structure; and
a first patterning station including an analog printing member or a digital printhead for forming the second pattern on a surface of the substrate in registration with the first pattern based on the identified location of the alignment structure.
2. The system of claim 1 , wherein the advancing mechanism includes a first mover for moving the substrate past the probe along a first direction.
3. The system of claim 2 , wherein the advancing mechanism further including a second mover for moving the substrate along a second direction different from the first direction.
4. The system of claim 2 , further including a supply roll and a take-up roll, wherein the advancing mechanism is configured to move the substrate from the supply roll toward the take-up roll.
5. The system of claim 4 , wherein the first patterning station is disposed between the probe and the take-up roll.
6. The system of claim 5 , further including a second patterning station disposed between the supply roll and the probe for forming the first pattern.
7. The system of claim 6 , wherein the probe is stationary in a fixed position, and the system further includes a curing station disposed between the second patterning station and the stationary probe.
8. The system of claim 6 , wherein the first patterning station is configured to form the second pattern on a same side of the substrate as the first pattern, and wherein the controller is configured to control the first patterning station so that the second pattern is formed in alignment with the alignment structure.
9. The system of claim 6 , wherein the first patterning station is configured to form the second pattern on an opposite side of the substrate as the first pattern, and wherein the controller is configured to control the first patterning station so that the second pattern is formed in alignment with the alignment structure.
10. The system of claim 6 , wherein the second patterning station includes an analog printing member or a digital printhead that is configured to print the first pattern and the alignment structure using a substantially transparent material.
11. The system of claim 1 , wherein the advancing mechanism is configured to provide a gap between the surface of the substrate and the probe.
12. The system of claim 11 , wherein the probe is a capacitance probe.
13. The system of claim 1 , wherein the advancing mechanism is configured to cause the surface of the substrate to contact the probe.
14. The system of claim 13 , wherein the probe is a resistance probe.
15. The system of claim 13 , wherein at least one contact surface of the probe has a rounded tip.
16. The system of claim 13 , wherein at least one contact surface of the probe is rotatable.
17. The system of claim 1 , wherein the probe includes:
a first contact member; and
a second contact member that is electrically insulated from the first contact member.
18. The system of claim 17 , wherein the probe further includes a third contact member that is electrically insulated from both the first contact member and the second contact member.
19. The system of claim 18 , wherein the second contact member is disposed between the first contact member and the third contact member, and wherein a distance between the first contact member and the second contact member is less than a distance between the second contact member and the third contact member.