IP Library Granted Patent US 9,301,041
Granted Patent B2
US 9,301,041 · App. 14/232,834 · Granted Mar 29, 2016

Headphone device

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Quick Facts
Patent No.
US 9,301,041
App. No.
14/232,834
Granted
Mar 29, 2016
Kind
B2
Abstract

A headphone comprises a speaker. The rear volume of the speaker is coupled to a mixing volume, the front volume of the speaker is coupled to the mixing volume, and the mixing volume is coupled to the exterior. The acoustic impedances resulting from the rear volume, the front volume, the mixing volume, and the passages between them can be adjusted, in order to achieve the desired sound egress properties. Acoustic damping material can be included in the various leakage paths in order to achieve the desired properties, depending on the type of speaker to be used, the acoustic design of the headphone, the mechanical properties of the headphone body, and the desired frequency response characteristics of the headphone.

Claims (29)

1. A headphone, comprising a speaker, wherein:

the rear volume of the speaker is coupled to a mixing volume through a first passage,

the front volume of the speaker is coupled to the mixing volume through a second passage, and

the mixing volume is coupled to the exterior through a third passage, wherein the third passage has a smaller cross-sectional area than the first or second passage.

2. A headphone as claimed in claim 1 , wherein the rear volume is coupled to the mixing volume through a passage containing an acoustic damping material.

3. A headphone as claimed in claim 1 , wherein the front volume is coupled to the mixing volume through a passage containing an acoustic damping material.

4. A headphone as claimed in claim 1 , wherein the mixing volume is coupled to the exterior through a passage containing an acoustic damping material.

5. A headphone as claimed in claim 1 , wherein the mixing volume is smaller than the rear volume.

6. A headphone as claimed in claim 5 , wherein the mixing volume is less than 50% of the rear volume.

7. A headphone as claimed in claim 6 , wherein the mixing volume is less than 25% of the rear volume.

8. A headphone as claimed in claim 7 , wherein the mixing volume is less than 10% of the rear volume.

9. A headphone as claimed in claim 8 , wherein the mixing volume is less than 5% of the rear volume.

10. A headphone as claimed in claim 1 , wherein the mixing volume is located within the headphone radially outwardly of the speaker.

11. A headphone as claimed in claim 10 , wherein the speaker has a circular cross-section, and the mixing volume extends continuously around the circumference of the speaker.

12. A headphone as claimed in claim 10 , wherein the speaker has a circular cross-section, and the mixing volume extends part way around the circumference of the speaker.

13. A headphone as claimed in claim 1 , in the form of an on-the-ear headphone.

14. A headphone as claimed in claim 1 , in the form of an in-the-ear headphone.

15. A headphone as claimed in claim 1 , in the form of an earbud-type headphone.

16. An audio system, comprising:

an audio source; and

a headphone, the headphone comprising a speaker, wherein:

the rear volume of the speaker is coupled to a mixing volume through a first passage,

the front volume of the speaker is coupled to the mixing volume through a second passage, and

the mixing volume is coupled to the exterior through a third passage, wherein the third passage has a smaller cross-sectional area than the first or second passage.

17. A method of preventing sound egress from a headphone, the method comprising:

mounting a speaker in the headphone;

forming a rear sound leakage path from a rear volume of the speaker to a mixing volume,

forming a front leakage path from a front volume of the speaker to the mixing volume, and

forming an outlet passage from the mixing volume to the exterior, wherein the outlet passage has a smaller cross-sectional area than the rear sound leakage path or the front leakage path.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2016
From: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
To: CIRRUS LOGIC, INC.
Reel/Frame 038933/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2015
From: CIRRUS LOGIC INTERNATIONAL (UK) LTD.
To: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
Reel/Frame 035806/0389 →
CHANGE OF NAME Recorded Apr 1, 2015
From: WOLFSON MICROELECTRONICS PLC
To: WOLFSON MICROELECTRONICS LTD
Reel/Frame 035353/0409 →
CHANGE OF NAME Recorded Apr 1, 2015
From: WOLFSON MICROELECTRONICS LTD
To: CIRRUS LOGIC INTERNATIONAL (UK) LTD.
Reel/Frame 035353/0413 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2014
From: NARAYAN, RENJISH
To: WOLFSON MICROELECTRONICS PLC
Reel/Frame 032164/0716 →