Polyamide compounds containing pitch carbon fiber
View Patent ↗A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix with pitch-based carbon fiber, boron nitride, and organophosphinate flame regardant dispersed in the matrix. The compound can be extruded or molded into a heat dissipating article.
1. A thermally conductive polymer compound, comprising:
(a) polyamide,
(b) pitch-based carbon fiber,
(c) boron nitride, and
(d) a non-halogenated organic phosphinate,
wherein the compound has an in-plane thermal conductivity of more than 8 W/mK as measured using ASTM E1461.
2. The compound of claim 1 , wherein the polyamide is polyamide 6.
3. The compound of claim 1 , wherein the boron nitride is hexagonal boron nitride.
4. The compound of claim 1 , further comprising an additive selected from the group consisting of adhesion promoters; biocides; anti-fogging agents; anti-static agents; bonding, blowing and foaming agents; dispersants; fillers and extenders; smoke suppressants; impact modifiers; initiators; lubricants; micas; pigments, colorants and dyes; plasticizers; processing aids; release agents; silanes, titanates and zirconates; slip and anti-blocking agents; stabilizers; stearates; ultraviolet light absorbers; viscosity regulators; waxes; catalyst deactivators, and combinations of them.
5. The compound of claim 1 , wherein the compound has ingredients in amounts expressed in weight percent:
Polyamide Matrix
20-45
Boron Nitride
15-45
Pitch-based Carbon
10-30
Fiber
Non-halogenated Flame
10-35
Retardant
Optional Other
0-20
Additives.
6. The compound of claim 1 , wherein the compound has ingredients in amounts expressed in weight percent:
Polyamide Matrix
25-40
Boron Nitride
20-40
Pitch-based Carbon
15-25
Fiber
Non-halogenated Flame
15-25
Retardant
Optional Other
0.2-15
Additives.
7. The compound of claim 1 , wherein the compound has ingredients in amounts expressed in weight percent:
Polyamide Matrix
27-37
Boron Nitride
25-35
Pitch-based Carbon
18-22
Fiber
Non-halogenated Flame
15-20
Retardant
Optional Other
0.2-10
Additives.
8. A molded article made from the compound of claim 1 .
9. An extruded article made from the compound of claim 1 .
10. A method of using the compound of claim 1 , wherein the compound is extruded or molded into an article designed to contact a headed object and conduct that heat away from that object or contact a heated object and conduct that heat toward a second object that needs heat also.
11. The method of claim 10 , wherein the polyamide of the compound is polyamide 6.
12. The method of claim 10 , wherein the boron nitride of the compound is hexagonal boron nitride.