IP Library Granted Patent US 9,203,358
Granted Patent B2
US 9,203,358 · App. 14/233,242 · Granted Dec 1, 2015

Radio frequency amplifier circuit

Inventors: Tomohide Kamiyama (Osaka, JP); Hiroshi Naitou (Osaka, JP); Takashi Uno (Hyogo, JP); Motoyoshi Iwata (Osaka, JP); Kazuhiro Yahata (Osaka, JP); Hikaru Ikeda (Osaka, JP)
Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
H03F1/56H01L23/66H03F1/565H03F3/601H01L2223/6611H01L2223/6655H01L2224/48091H01L2224/48137H01L2224/49175H01L2224/73265H03F3/191
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Quick Facts
Patent No.
US 9,203,358
App. No.
14/233,242
Granted
Dec 1, 2015
Kind
B2
Abstract

A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal.

Claims (24)

1. A radio frequency amplifier circuit comprising, on a mounting surface inside a package:

a transistor amplifying a radio frequency signal;

an input-side matching circuit; and

an output-side matching circuit,

wherein the output-side matching circuit includes:

a first distributed constant line to which the radio frequency signal from the transistor is transmitted via a plurality of first wires arranged in parallel;

a lead terminal in a flat plate shape to which the radio frequency signal from the first distributed constant line is transmitted via a plurality of second wires arranged in parallel, the lead terminal transmitting the radio frequency signal to an outside of the package; and

a capacitive element having one electrode that is connected to the lead terminal via a third wire and another electrode that is grounded,

the lead terminal is partially joined to a sealing resin having a lower dielectric constant than the first distributed constant line, and

the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting, on the mounting surface, an alignment direction of the first distributed constant line and the lead terminal.

2. The radio frequency amplifier circuit according to claim 1 , further comprising

a second distributed constant line disposed between the first distributed constant line and the transistor, the second distributed constant line being connected to the transistor via a plurality of fourth wires arranged in parallel and being connected to the first distributed constant line via the plurality of first wires.

3. The radio frequency amplifier circuit according to claim 1 ,

wherein the first distributed constant line and the capacitive element are formed of a single continuous dielectric substrate.

4. The radio frequency amplifier circuit according to claim 1 ,

wherein the capacitive element comprises a plurality of capacitive elements, and

the plurality of capacitive elements are disposed symmetrically on both sides along the intersecting direction of the first distributed constant line.

5. The radio frequency amplifier circuit according to claim 1 ,

wherein the transistor comprises a plurality of transistors, and

a plurality of unit transmission lines, each of which is constituted by the first distributed constant line and the capacitive element and provided for a different one of the plurality of transistors, are disposed in parallel between the plurality of transistors and the lead terminal.

6. The radio frequency amplifier circuit according to claim 5 ,

wherein the unit transmission lines that are adjacent to each other are connected via a resistor.

7. The radio frequency amplifier circuit according to claim 2 ,

wherein the first distributed constant line and the capacitive element are formed of a single continuous dielectric substrate.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0870 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2014
From: KAMIYAMA, TOMOHIDE; NAITOU, HIROSHI; UNO, TAKASHI; IWATA, MOTOYOSHI; YAHATA, KAZUHIRO; IKEDA, HIKARU
To: PANASONIC CORPORATION
Reel/Frame 032753/0064 →
Priority Claims (1)
JP 2012-120094 · May 25, 2012 · national
Continuity (1)
Related Publication 20140191809A1 · Jul 10, 2014