IP Library Granted Patent US 9,368,700
Granted Patent B2
US 9,368,700 · App. 14/233,754 · Granted Jun 14, 2016

Optoelectronic component and method for producing an optoelectronic component

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Quick Facts
Patent No.
US 9,368,700
App. No.
14/233,754
Granted
Jun 14, 2016
Kind
B2
Abstract

An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element.

Claims (46)

1. An optoelectronic component comprising:

a substrate;

a semiconductor chip arranged on the substrate;

a wettable attractor element arranged on the substrate;

a medium comprising pigments, the medium at least regionally covering an exposed region of the substrate that is not covered by the semiconductor chip and the attractor element and at least partly wetting the semiconductor chip and the attractor element; and

a further semiconductor chip, wherein the attractor element is arranged between the semiconductor chip and the further semiconductor chip; and

wherein the semiconductor chip and the further semiconductor chip each compromise a light-emitting surface, wherein the medium at least partly wets side areas of the semiconductor chips, and wherein the light-emitting surfaces of the semiconductor chips are not wetted by the medium.

2. The optoelectronic component according to claim 1 , wherein the medium comprising pigments has a minimum thickness above the substrate of at least 10% of a smaller height of attractor element and of semiconductor chip above the substrate.

3. The optoelectronic component according to claim 1 , wherein the attractor element has a height above the substrate of 10% to 300% of a height of the semiconductor chip.

4. The optoelectronic component according to claim 1 , wherein the attractor element is arranged centrally between the semiconductor chip and the further semiconductor chip and has a height above the substrate between 80% and 120% of a height of the semiconductor chip.

5. The optoelectronic component according to claim 1 , wherein the medium comprises at least one material selected from the group consisting of:

silicone;

epoxy resin; and

hybrid materials.

6. The optoelectronic component according to claim 1 , wherein the medium is filled with white pigments which are composed of at least one material selected from the group consisting of:

titanium dioxide (TiO 2 );

aluminum oxide (Al 2 O 3 ); and

zirconium oxide (ZrO).

7. The optoelectronic component according to claim 1 , wherein the medium is filled with black pigments which are composed of at least one material selected from the group consisting of:

carbon black particles; and

graphite particles.

8. The optoelectronic component according to claim 1 , wherein the medium is filled with chromatic pigments.

9. The optoelectronic component according to claim 1 , further comprising a layer comprising luminophore particles or a layer comprising diffuser particles overlying on an area of the semiconductor chip facing away from the substrate, on an area of the attractor element facing away from the substrate and on the medium.

10. A method for producing an optoelectronic component according to claim 1 , the method comprising:

providing a substrate with a semiconductor chip and a further semiconductor chip arranged thereon;

arranging a wettable attractor element over the substrate;

at least regionally applying a liquid medium comprising pigments to an exposed region of the substrate that is not covered by the semiconductor chip, the further semiconductor chip and the attractor element, wherein the semiconductor chip, the further semiconductor chip and the attractor element are at least partly wetted; and

curing the liquid medium.

11. The method according to patent claim 10 , wherein the liquid medium is applied by dispensing.

12. An optoelectronic component comprising:

a substrate;

a semiconductor chip arranged on the substrate;

a wettable attractor element arranged on the substrate; and

a medium comprising pigments, the medium at least regionally covering an exposed region of the substrate that is not covered by the semiconductor chip and the attractor element and at least partly wetting the semiconductor chip and the attractor element;

wherein the medium is filled with one of chromatic pigments or black pigments, wherein the black pigments are composed of at least one material selected from a group consisting of carbon black particles and graphite particles.

13. An optoelectronic component comprising:

a substrate;

a semiconductor chip arranged on the substrate;

a wttable attractor element arranged on the substrate; and

a medium comprising pigments, the medium at least regionally covering an exposed region of the substrate that is not covered by the semiconductor chip and the attractor element and at least partly wetting the semiconductor chip and the attractor element,

wherein at least one of:

the attractor element has a bonding wire;

the attractor element is composed of polybutylene terephthalate (PBT);

the attractor element has a delimiting element and an inner structure, wherein the delimiting element and the inner structure are embodied in one piece;

the attractor element has an inner structure that has the form of a grid; and

the component comprises a plurality of semiconductor chips including said semiconductor chip and a plurality of attractor elements including said wettable attractor element, wherein distances between adjacent semiconductor chips, between adjancet attractor element as well as between adjacent semiconductor chips and adjancet attractor elements are uniform.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2014
From: JEREBIC, SIMON; HEINEMANN, ERIK; PINDL, MARKUS; BESTELE, MICHAEL; MARFELD, JAN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 032467/0765 →