Electrically conductive adhesive compound and adhesive tape
View Patent ↗A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.
1. A pressure-sensitive adhesive composition comprising
a) a polymer-metal blend comprising
at least one pressure-sensitive adhesive, and
at least one metal component melting in a temperature range from 50° C. to 400° C., and
b) at least one fibrous, electrically conductive filler, wherein the filler is present, at least partly, in a form of a bound fiber network with the at least one metal component.
2. The pressure-sensitive adhesive composition according to claim 1 , wherein the at least one metal component is a metal or a metal alloy.
3. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive is a pressure-sensitive polyacrylate adhesive.
4. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive is a pressure-sensitive rubber adhesive.
5. The pressure-sensitive adhesive composition according to claim 1 , wherein at least one of the at least one fibrous, electrically conductive filler is metallic.
6. The pressure-sensitive adhesive composition according to claim 1 , wherein at least one of the at least one fibrous, electrically conductive filler is a carbon modification or a carbon-containing chemical compound.
7. The pressure-sensitive adhesive composition according to claim 1 , wherein at least one of the at least one fibrous, electrically conductive filler is magnetic.
8. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive has a layer thickness of 50 μm and a water vapor permeation of less than 50 g/m 2 d at 38° C. and 50% relative humidity.
9. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive has a water content of less than 5000 ppm determined after 72 h of conditioning at 23° C. and 50% relative humidity by means of Karl Fischer titration.
10. The pressure-sensitive adhesive composition according to claim 9 , wherein the pressure-sensitive adhesive has a water content of less than 1000 ppm determined after 72 h of conditioning at 23° C. and 50% relative humidity by means of Karl Fischer titration.
11. A pressure-sensitive adhesive tape comprising at least one layer of the pressure-sensitive adhesive composition according to claim 1 .
12. The pressure-sensitive adhesive tape according to claim 11 , further comprising a layer of a carrier material.
13. The pressure-sensitive adhesive tape according to claim 11 , wherein the layer of a carrier material comprises an electrically conductive carrier material.
14. A method for adhesive bonding on a first substrate surface, the method comprising:
bonding the first substrate surface with the pressure-sensitive adhesive composition according to claim 1 or the pressure-sensitive adhesive tape according to claim 11 .
15. The method according to claim 14 , further comprising bonding the first substrate surface to a second substrate surface, at a bond site, with the pressure-sensitive adhesive composition according to claim 1 or the pressure-sensitive adhesive tape according to claim 11 .
16. The method according to claim 15 , further comprising:
heating the bond site, during or after the bonding operation, to a temperature above the melting temperature of the at least one metal component.