Electrically conductive heat-activated adhesive compound

1. An adhesive film, bondable when heat-activated, comprising

a) a polymer-metal blend comprising

at least one adhesive, bondable when heat-activated, and

at least one metal component meltable in the temperature range from 50° C. to 400° C., and

b) at least one fibrous, electrically conductive filler,

wherein the at least one fibrous, electrically conductive filler is present, at least partly, in a form of a bound fiber network with the at least one metal component such that fibers of the at least one fibrous, electrically conductive filler are present in a form bound to one another by the at least one metal component, and

further wherein the at least one fibrous, electrically conductive filler comprises aluminum, copper, silver, gold, nickel, mu-metal, alnico, permalloy, ferrite, carbon nanotubes and graphene.

2. The adhesive film according to claim 1 , wherein fibers of the at least one fibrous, electrically conductive filler have an aspect ratio of at least 3, wherein the aspect ratio is a ratio between a greatest longitudinal extent and a small longitudinal extent of the fibers.

3. The adhesive film according to claim 2 , wherein the aspect ratio of the fibers is at least 10.

4. The adhesive film according to claim 2 , wherein fibers of the at least one fibrous, electrically conductive filler have a fiber length from 1 to 10 mm.

5. The adhesive film according to claim 1 , wherein at least one of the at least one fibrous, electrically conductive fillers is a carbon modification or a carbon-containing chemical compound.

6. The adhesive film according to claim 5 , wherein the at least one fibrous, electrically conductive filler consists of copper-coated carbon fibers or nickel-coated carbon fibers.

7. The adhesive film according to claim 1 , wherein the at least one fibrous, electrically conductive filler comprises at least one selected from copper and nickel.

8. The adhesive film according to claim 7 , wherein the at least one fibrous, electrically conductive filler consists of coppered aluminum fibers or nickeled aluminum fibers.

9. The adhesive film according to claim 1 , wherein the fibers of the at least one fibrous and regions formed by the at least one metal component are aligned in a first direction or orientation.

10. The adhesive film according to claim 9 , wherein the first direction or orientation is substantially perpendicular to the plane of the adhesive film.

11. The adhesive film according to claim 1 , wherein the at least one metal component is a metal or a metal alloy.

12. The adhesive film according to claim 1 , wherein the at least one adhesive, bondable when heat-activated, is a heat-activatable thermoplastic adhesive.

13. The adhesive film according to claim 1 aims, wherein the at least one adhesive, bondable heat-activated, is a heat-activatable reactive adhesive.

14. The adhesive film according to claim 1 , wherein fibers of the at least one fibrous, electrically conductive filler have a fiber length between 0.1 and 0.9 mm.

15. The adhesive film according to claim 1 , wherein the fibers of the at least one fibrous have a thickness of at least 60 μm and no more than 180 μm.

16. A method for adhesive bonding on a first substrate surface, the method comprising:

bonding the first substrate by means of the adhesive film according to claim 1 , which is heat-activated for bonding on the first substrate.

17. The method according to claim 16 , further comprising:

bonding a surface of the first substrate to a surface of a second substrate by means of the adhesive film that has been heat-activated.

18. The method according to claim 17 , wherein

first of all the adhesive film is subjected to a preliminary fastening onto the surface of the first substrate, by the adhesive film being activated at a temperature below the melting temperature of the metal component; and

thereafter a final fixing is brought about, by the adhesive film being activated on the surface of the first substrate, or in a final disposition between the surfaces of the first and second substrates, at a temperature above the melting temperature of the metal component.

19. The method according to claim 16 , wherein the heat the activation of the adhesive film is performed at a temperature below the melting temperature of the metal component.

20. The method according to claim 16 , wherein the adhesive bonding is brought about by means of the adhesive film, which can be bonded when heat-activated, and the filler is oriented by means of a magnetic field before or during the activation.