LED mixing chamber with reflective walls formed in slots
View Patent ↗A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.
1. A device comprising:
a substrate, the substrate having at least a portion of a first surface being reflective;
a plurality of LED dies mounted on the first surface of the substrate;
a metal ring formed over the substrate and surrounding the plurality of LED dies, the metal ring providing a etch stop, the metal ring having a width that extends at least to a singulation line for the device;
a mixing chamber comprising:
a light-transmissive covering layer over the substrate, metal ring, and LED dies;
a slot etched in the covering layer surrounding the LED dies, the slot being formed overlying the metal ring while using the metal ring as an etch stop;
a reflective material at least partially filling the slot to form a reflective wall around the LED dies, the reflective wall having a height above the substrate that is greater than a height of a top surface of the LED dies above the substrate, the reflective wall having an inside surface facing the plurality of LED dies and having an outside surface; and
a portion of the covering layer being present around the outside surface of the reflective material after singulation of the substrate to form individual devices, wherein the metal ring extends beyond the outside surface of the reflective material to the singulation line,
wherein the covering material around the outside surface of the reflective material and above the metal ring is etched, using the metal ring as an etch stop, followed by singulation of the substrate.
2. The device of claim 1 wherein the LED dies emit blue light, the device further comprising depositing a wavelength converting layer overlying the covering layer.
3. The device of claim 2 wherein the wavelength converting layer is applied as sheet material, liquid material, partially cured material, or spin-on material.
4. The device of claim 1 wherein the covering layer has a substantially planar top surface.
5. The device of claim 1 wherein the covering layer encapsulates the LED dies.
6. The device of claim 1 wherein the LED dies are bare dies.