IP Library Granted Patent US 8,988,668
Granted Patent B2
US 8,988,668 · App. 14/239,468 · Granted Mar 24, 2015

Film thickness measurement apparatus and film thickness measurement method

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Quick Facts
Patent No.
US 8,988,668
App. No.
14/239,468
Granted
Mar 24, 2015
Kind
B2
Abstract

A film thickness measurement apparatus includes: an ECT sensor for measuring a film thickness of a thermal barrier coating formed on a turbine blade; a storage unit for storing a measurement point on the turbine blade which is a point where the film thickness of the thermal barrier coating is measured; a laser displacement meter for measuring a shape of the turbine blade; a measurement position calculation unit for calculating an actual measurement point suitable for actual film thickness measurement using the ECT sensor, based on the shape of the turbine blade measured by the laser displacement meter and the measurement point on the turbine blade stored in the storage unit; and an arm drive unit for driving the ECT sensor to adjust a measurement position of the ECT sensor based on the actual measurement point calculated by the measurement position calculation unit.

Claims (14)

1. A film thickness measurement apparatus comprising:

a film thickness measurement unit that measures a film thickness of a thermal barrier coating formed on an object to be measured;

a storage unit that stores a measurement point on the object to be measured which is a point where the film thickness of the thermal barrier coating is measured;

a shape measurement unit that measures a shape of the object to be measured;

a measurement position calculation unit that calculates an actual measurement point suitable for actual film thickness measurement using the film thickness measurement unit, based on the shape of the object to be measured which is measured by the shape measurement unit and the measurement point on the object to be measured which is stored in the storage unit; and

a drive unit that drives the film thickness measurement unit to adjust a measurement position of the film thickness measurement unit based on the actual measurement point calculated by the measurement position calculation unit.

2. The film thickness measurement apparatus according to claim 1 , wherein the shape measurement unit performs scanning with laser light in a linear direction to calculate the shape of the object to be measured in a two-dimensional plane.

3. The film thickness measurement apparatus according to claim 1 , further comprising a temperature measurement unit that measures a surface temperature of the thermal barrier coating,

wherein the film thickness measurement unit corrects the measured film thickness based on the surface temperature measured by the temperature measurement unit.

4. A film thickness measurement method comprising the steps of:

a film thickness measurement unit measuring a film thickness of a thermal barrier coating formed on an object to be measured;

a shape measurement unit measuring a shape of the object to be measured;

a measurement position calculation unit calculating an actual measurement point suitable for actual film thickness measurement using the film thickness measurement unit, based on the shape of the object to be measured which is measured by the shape measurement unit and a measurement point on the object to be measured which is stored in a storage unit and is a point where the film thickness of the thermal barrier coating is measured; and

a drive unit driving the film thickness measurement unit to adjust a measurement position of the film thickness measurement unit based on the actual measurement point calculated by the measurement position calculation unit.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVING PATENT APPLICATION NUMBER 11921683 PREVIOUSLY RECORDED AT REEL: 054975 FRAME: 0438. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 26, 2023
From: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
To: MITSUBISHI POWER, LTD.
Reel/Frame 063787/0867 →
CHANGE OF NAME Recorded Jan 13, 2021
From: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
To: MITSUBISHI POWER, LTD.
Reel/Frame 054975/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2015
From: MITSUBISHI HEAVY INDUSTRIES, LTD.
To: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
Reel/Frame 034910/0416 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2014
From: KUROKAWA, MASAAKI; YASUI, JUN; KENMOTSU, KEIICHI; SHIOTANI, SHIGETOSHI
To: MITSUBISHI HEAVY INDUSTRIES, LTD.
Reel/Frame 032246/0007 →