Component and Method for Producing a Component

1 - 15 . (canceled)

16 . A component comprising:

a substrate;

a chip;

a frame, the frame, the substrate and the chip enclosing a volume; and

a metal sealing layer which hermetically seals the volume, the metal sealing layer comprising a solidified liquid metal or a solidified liquid metal alloy.

17 . The component according to claim 16 ,

wherein the frame is connected to the substrate and the chip bears on the frame; and

wherein the metal sealing layer extends along a gap between the chip and the frame and connects the chip and the frame.

18 . The component according to claim 16 ,

wherein the frame is connected to the chip and the frame bears on the substrate; and

wherein the metal sealing layer extends along a gap between the substrate and the frame and connects the substrate and the frame.

19 . The component according to claim 16 , wherein the substrate, the chip, the frame and the metal sealing layer are at least partially enclosed by an electrolytically deposited layer.

20 . The component according to claim 16 , wherein the metal sealing layer constitutes a jet printing structure.

21 . The component according to claim 16 , wherein the metal sealing layer comprises a solder structure.

22 . The component according to claim 16 , wherein the chip is interconnected with the substrate on a surface inclined toward the enclosed volume by at least one bump connection.

23 . The component according to claim 16 , wherein the at least one bump connection comprises a stud bump or solder bump.

24 . The component according to claim 16 , wherein the frame comprises a metal or a multilayer structure of metals.

25 . The component according to claim 16 , wherein the liquid metal or the liquid metal alloy for forming the metal sealing layer by solidification comprises metals with melting points of less than 300° C. under standard conditions.

26 . The component according to claim 16 , wherein the liquid metal or the liquid metal alloy for forming the metal sealing layer comprises metals of a nonzero wettability with the surface of the chip and/or of the substrate.

27 . A method for producing a component having a substrate, a chip and a frame, the method comprising:

enclosing a volume between the frame, the substrate and the chip; and

hermetically sealing the volume with a metal sealing layer by applying a liquid metal or a liquid metal alloy onto the component and solidifying the liquid metal or the liquid metal alloy.

28 . The method according to claim 27 ,

wherein the frame is connected to the substrate and the chip bears on the frame; and

wherein the metal sealing layer is applied along a gap between the chip and the frame and connects the chip and the frame by solidification of the liquid metal or the liquid metal alloy.

29 . The method according to claim 27 , wherein

the frame is connected to the chip and the frame bears on the substrate; and

the metal sealing layer is applied along a gap between the substrate and the frame and connects the substrate and the frame by solidification of the liquid metal or the liquid metal alloy.

30 . The method according to claim 27 , wherein the liquid metal or the liquid metal alloy is applied by dosing with a jet printing technique.

31 . The method according to claim 27 , wherein the liquid metal or the liquid metal alloy is applied by applying a solder depot and heating the solder depot.

32 . The method according to claim 27 , wherein the liquid metal or the liquid metal alloy is applied by at least partially immersing the component in a liquid solder.

33 . The method according to claim 27 , wherein the liquid metal or liquid metal alloy has a melting point of less than 300° C.

34 . The method according to claim 27 , further comprising electrolytically deposits a layer over the metal sealing layer.

35 . The method according to claim 27 , wherein the liquid metal or liquid metal alloy comprises a solder.