Insulation systems with improved resistance to partial discharge, production method for this
View Patent ↗An insulating system having improved partial discharge resistance includes an insulating tape around a conductor. The tape is a mica tape joined to a carrier. The tape is impregnated with a synthetic resin, and is interspersed with a nanoparticulate filler, present bimodally, in the form of two fractions of the filler differing in particle size and fraction size. An adhesion promoter may be in the resin.
1. An insulating system with improved partial discharge resistance, comprising:
an insulating tape which is wound around an electrical conductor, the insulating tape comprising a mica tape joined to a carrier material,
the insulating tape being impregnated with a synthetic resin, and the synthetic resin being interspersed with a nanoparticulate filler which is present bimodally, in the form of two fractions of nanoparticulate filler;
wherein the two fractions of the nanoparticulate filler differ in their respective average particle sizes, the first fraction having an average particle size of between 10 and 50 nm and being present in a concentration of 10 to 50 wt % in the synthetic resin, and the second fraction has an average particle size of between 1 and 5 nm and is present in a concentration of 1 to 10 wt %.
2. The insulating system as claimed in claim 1 , wherein a resin basis of the synthetic resin impregnated in the insulating tape is selected from the group consisting of epoxide-based resins and/or polyurethanes.
3. The insulating system as claimed in claim 1 , further comprising an adhesion promoter in the synthetic resin.
4. The insulating system as claimed in claim 1 , wherein at least one of the fractions of the nanoparticulate filler is of a material selected from the group consisting of metal oxides, metal nitrides, metal sulfides and/or metal carbides.
5. The insulating system as claimed in claim 1 , wherein the nanoparticulate filler comprises particles having particle diameters of 0.5 nm to 80 nm.
6. The insulating system as claimed in claim 1 , wherein the nanoparticulate filler is present in the synthetic resin in a concentration of between 3 and 80 wt %.
7. The insulating system as claimed in claim 3 , further comprising an organosilicon compound used as the adhesion promoter.
8. The insulating system as claimed in claim 3 , wherein the adhesion promoter is present in a concentration of 0.1 to 45 wt % in the synthetic resin.
9. The insulating system as claimed in claim 1 , wherein the average particle diameter of the first fraction is in a range from 12 to 40 nm.
10. The insulating system as claimed in claim 9 , wherein said average particle diameter is in a range from 15 to 30 nm.
11. The insulating system as claimed in claim 4 , wherein at least one of the fractions of nanoparticulate filler is of a material selected from the group consisting of silicon dioxide and/or aluminum dioxide.
12. The insulating system as claimed in claim 8 , wherein the adhesion promoter is present in a concentration of 1-25 wt % in the synthetic resin.
13. The insulating system as claimed in claim 5 , wherein the nanoparticulate filler is present in the synthetic resin in a concentration of between 3 and 80 wt %.
14. A method for producing an insulating system having improved partial discharge resistance presented, comprising the following method steps:
providing an insulating tape which comprises a mica paper and a carrier material, which are bonded to one another by means of an adhesive;
enwinding an electrical conductor with the insulating tape; and
impregnating the insulating tape wound around the conductor with synthetic resin which comprises a nanoparticulate filler, present in bimodal form, as a combination of two fractions, to form the insulating tape of claim 1 .