CONTOURED SUPPORT GRID FOR HERMETICALLY SEALED THIN FILM APPLICATIONS
Systems and methods for manufacturing a vacuum device, such as an electron emitter, that includes a foil exit window palced over and joined to a support grid. In one particular method, the vacuum chamber of an electron emitter has a thin foil forming an exit window at one end. The thin foil may be titanium or any suitable material and the foil will typically enlarge during a bonding process that attaches the foil to the support grid. In one manufacturing process, the support grid is provided with a surface that has contours, typically being smooth recessed surfaces, that the foil once enlarged can lie against as the vacuum pulls the foil against the grid.
1 . An exit window for an emitter comprising:
a support plate having a series of apertures for allowing passage of a beam there through; and
an exit window foil bonded over the support plate, the support, plate having a planar surface and at least one surface recess which allows portions of the exit window foil to rest within the recess to reduce wrinkle formation.
2 . The exit window of claim 1 wherein the support plate has a first pattern of surface recesses.
3 . The exit, window of claim 2 wherein the first pattern of surface recesses extend in a lateral direction relative to the support plate.
4 . The exit window of claim 2 wherein the first pattern of surface recesses are in central regions of the support plate, and a second pattern of surface recesses are in edge regions.
5 . The exit window of claim 2 wherein the first pattern of surface recesses extends in a longitudinal direction relative to the support plate.
6 . The exit window of claim 1 wherein the at least one surface recess extends in a longitudinal direction relative to the support plate.
7 . The exit window of claim 1 wherein the at least one surface recess includes at least one groove.
8 . A process for manufacturing a support plate for an exit window having a foil transmissive layer, comprising
providing a support grid of a first material having a first coefficient of thermal expansion;
providing a layer of transmissive material the layer having a length, a width and an initial surface area, covering the support grid to form a seal over the grid, the layer of transmissive material having a second different coefficient of thermal expansion,
determining as a function of at least the first and second coefficients of thermal expansion, an expanded surface area represented of a surface area of the transmissive layer after a thermal expansion; and
forming a contour Is the support grid to provide the support grid with a surface area on its upper surface comparable to the expanded surface area.
9 . The process of claim 8 , further comprising determining the expanded surface area as a function of thermal expansion arising from a thermal increased caused by a diffusion bonding operation.
10 . The process of claim 8 , further comprising locating an expansion initiation point on the layer of transmissive material representative of a location at which a thermal expansion process commences.
11 . The process of claim 10 , wherein locating includes identifying a location proximate a boundary between a joint between the support grid and layer of transmissive material and a free section of the layer of transmissive material.
12 . The process of claim 8 , further comprising selecting a surface finish for the contour.
13 . The process of claim 8 , further comprising placing a plurality of substantially evenly spaced contours across an upper surface of the support grid.