SOLID STATE PHOTO MULTIPLIER DEVICE
A method and an apparatus for detecting photons are disclosed. The apparatus includes a solid state photo multiplier device having a plurality of microcells that have a band gap greater than about 1.7 eV at 25° C. The solid state photo multiplier device further includes an integrated quenching device and a thin film coating associated with each of the microcells. The solid state photo multiplier device disclosed herein operates in a temperature range of about −40° C. to about 275° C.
1 . A method of detecting a high energy radiation in a down-hole drilling application, the method comprising:
detecting the high energy radiation by producing photons in a scintillator exposed to the high energy radiation;
detecting the photons by a solid state photo multiplier device at a temperature greater than about 175° C.; and
processing the detected photons at a temperature greater than 175° C. using an associated electronics producing signals corresponding to the detected photons, wherein the solid state photo multiplier device comprises:
a plurality of microcells having a bandgap greater than about 1.7 eV at 25° C.;
an integrated quenching device associated with each of the individual microcells; and
a thin film coating on a semiconductor surface of each microcell.
2 . The method of claim 1 , further comprising increasing signal to noise ratio of the produced signals at a temperature greater than about 175° C., using a noise reduction electronics.
3 . The method of claim 1 , wherein an active area of the solid state photo multiplier has a peak quantum efficiency greater than about 40%.
4 . The method of claim 1 , wherein a thickness of the thin film coating is in a range from about 10 nm to about 10 microns.
5 . A method, comprising: detecting photons by a solid state photo multiplier device at a temperature ranging from about −40° C. to about 275° C., wherein the solid state photo multiplier device comprises:
a plurality of microcells having a bandgap greater than about 1.7 eV at 25° C.;
an integrated quenching device associated with each of the individual microcells; and
a thin film coating on a semiconductor surface of each microcell.
6 . The method of claim 5 , further comprising processing the detected photons at a temperature ranging from about −40° C. to about 275° C. using an associated electronics producing signals corresponding to the detected photons.
7 . The method of claim 6 , further comprising increasing signal to noise ratio of the produced signals at a temperature ranging from about −40° C. to about 275° C., using a noise reduction electronics.
8 . The method of claim 7 , further comprising dynamically setting gain of an associated variable gain amplifier according to signal levels of the solid state photo multiplier device.
9 . The method of claim 5 , further comprising detecting a high energy radiation by producing the photons in a scintillator exposed to the high energy radiation.
10 . The method of claim 9 , further comprising differentiating high energy radiation of at least two different energy levels and assigning counts for each energy level.
11 . The method of claim 5 , wherein a thickness of the thin film coating is in a range from about 10 nm to about 10 microns.
12 . A method, comprising:
detecting photons by a solid state photo multiplier device over a temperature variation of 200° C. or more, wherein the solid state photo multiplier device comprises:
a plurality of microcells having a bandgap greater than about 1.7 eV at 25° C.;
an integrated quenching device associated with each of the individual microcells; and a thin film coating on a semiconductor surface of each microcell.
13 . The method of claim 12 , further comprising processing the detected photons over a temperature variation of 200° C. or more using an associated electronics producing signals corresponding to the detected photons.
14 . The method of claim 13 , further comprising increasing signal to noise ratio of the produced signals over a temperature variation of 200° C. or more, using a noise reduction electronics.
15 . The method of claim 12 , wherein an active area of the solid state photo multiplier has a peak quantum efficiency greater than about 40%.
16 . The method of claim 12 , wherein a thickness of the thin film coating is in a range from about 10 nm to about 10 microns.
17 . An apparatus for detecting photons, the apparatus comprising:
a solid state photo multiplier device, comprising:
a plurality of microcells having a bandgap greater than about 1.7 eV at 25° C.;
an integrated quenching device associated with each of the microcells; and
a thin film coating on a semiconductor surface of each microcell, wherein the solid state photo multiplier device operates at a temperature ranging from about −40° C. to about 275° C.
18 . The apparatus of claim 17 , wherein the integrated quenching device comprises a resistor, a diode, a transistor, a capacitor, or a combination thereof.
19 . The apparatus of claim 17 , wherein the integrated quenching device comprises a semiconductor, a poly wide bandgap semiconductor, a polysilicon, a metal, a ceramic, or a combination thereof.
20 . The apparatus of claim 17 , wherein the solid state photo multiplier device comprises SiC, GaP, GaN, alloys of InxGa1-xN, alloys of AlxInyGa1-x-yN, alloys of AlxGa1-xAs, or combinations thereof, 0≦x, y≦1.
21 . The apparatus of claim 17 , wherein a thickness of the thin film coating is in a range from about 10 nm to about 10 microns.
22 . The apparatus of claim 17 , wherein the solid state photo multiplier device has a peak quantum efficiency of greater than 40%.
23 . The apparatus of claim 17 , wherein the solid state photo multiplier device is coupled to a scintillator configured to detect a high energy radiation.
24 . The apparatus of claim 17 , wherein multiple solid state photo multiplier devices are tiled adjacent to one another to cover an area of 5 mm 2 or greater.
25 . The apparatus of claim 17 , having an energy resolution less than about 50% for a radiation in a range from about 50 keV to about 10 MeV.
26 . The apparatus of claim 25 , having an energy resolution less than about 20% for radiation of in a range from about 50 keV to about 10 MeV.
27 . The apparatus of claim 17 , configured for gross counting of the detected high energy radiation at the operating temperature of the solid state photo multiplier device.
28 . The apparatus of claim 17 , further comprising noise reduction electronics configured to operate at the operating temperature of the solid state photo multiplier device.
29 . The apparatus of claim 28 , wherein the noise reduction electronics comprises a multiplexing and summing circuit.
30 . The apparatus of claim 28 , wherein the noise reduction electronics further comprises variable gain amplifiers.
31 . The apparatus of claim 17 , further comprising a microcutting device for elimination of bad pixels.
32 . The apparatus of claim 17 , further comprising a high energy radiation source.
33 . The apparatus of claim 17 , wherein the solid state photo multiplier device is configured to detect photons at a temperature greater than about 175° C.
34 . The apparatus of claim 17 , wherein the solid state photo multiplier device is configured to operate over a temperature variation of 200° C. or more.