Light emitting device and method for manufacturing the same
By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
1. A light emitting device comprising:
a substrate having a top surface and a bottom surface opposite from the top surface, the substrate including a lighting area and a peripheral area surrounding the lighting area in the top surface of said substrate;
a positive electrode land exposed for external connection on the top surface and a negative electrode land exposed for external connection on the top surface, said positive and negative electrode lands being provided on the peripheral area of said substrate;
wiring patterns including a cathode wiring pattern and an anode wiring pattern disposed on the top surface of said substrate and connected to said positive and negative electrode lands, respectively;
a light emitting unit formed on the lighting area of said substrate, including a plurality of light emitting elements electrically connected between the cathode and anode wiring patterns, and a sealing member for sealing and continuously covering the plurality of light emitting elements, the sealing member being located within the lighting area; and
a positive polarity symbol provided on the top surface in the peripheral area and adjacent to said positive electrode land,
wherein the positive electrode land and the negative electrode land are disposed on the peripheral area of the top surface so that the positive and negative electrode lands do not extend over an edge of the substrate,
the positive electrode land and the negative electrode land are disposed on the peripheral area of the top surface opposite to each other so as to have the light emitting unit between the lands such that the lands do not overlap the light emitting unit,
a first lead-out wiring pattern is disposed between the positive electrode land and the anode wiring pattern, and
a second lead-out wiring pattern is disposed between the negative electrode land and the cathode wiring pattern.
2. The light emitting device of claim 1 , further comprising a negative polarity symbol provided on the peripheral area in the top surface of said substrate and adjacent to said negative electrode land.
3. The light emitting device of claim 1 , wherein the sealing member is composed of a light-transmitting resin.
4. The light emitting device of claim 3 , wherein the sealing member contains a fluorescent material.
5. The light emitting device of claim 3 , wherein the light-transmitting resin is a silicone resin.
6. The light emitting device of claim 1 , wherein a through hole penetrating the substrate is formed in the peripheral area.
7. The light emitting device of claim 1 , wherein the substrate is shaped as one of a hexagon, a rectangle and a square.
8. The light emitting device of claim 1 , wherein the substrate has a thickness of about 1 mm.
9. The light emitting device of claim 1 , wherein a hole having a cut-out shape and penetrating the substrate is formed in the peripheral area.
10. The light emitting device of claim 1 , wherein the positive electrode land is large in width than the first lead-out wiring pattern, and the negative electrode land is large in width than the second lead-out wiring pattern.
11. A light emitting device comprising:
a substrate having a top surface and a bottom surface opposite from the top surface, the substrate including a lighting area and a peripheral area surrounding the lighting area in the top surface of said substrate;
a positive electrode land exposed for external connection on the top surface and a negative electrode land exposed for external connection on the top surface, said positive and negative electrode lands being provided on the peripheral area of said substrate;
wiring patterns including a cathode wiring pattern and an anode wiring pattern disposed on the top surface of said substrate and connected to said positive and negative electrode lands, respectively;
a light emitting unit formed on the lighting area of said substrate, including a plurality of light emitting elements electrically connected between the cathode and anode wiring patterns, and a sealing member for sealing and continuously covering the plurality of light emitting elements, the sealing member being located within the lighting area; and
a negative polarity symbol provided on the top surface in the peripheral area and adjacent to said negative electrode land,
wherein the positive electrode land and the negative electrode land are disposed on the peripheral area of the top surface so that the positive and negative electrode lands do not extend over an edge of the substrate,
the positive electrode land and the negative electrode land are disposed on the peripheral area of the top surface opposite to each other so as to have the light emitting unit between the lands such that the lands do not overlap the light emitting unit,
a first lead-out wiring pattern is disposed between the positive electrode land and the anode wiring pattern, and
a second lead-out wiring pattern is disposed between the negative electrode land and the cathode wiring pattern.
12. The light emitting device of claim 11 , wherein the sealing member is composed of a light-transmitting resin.
13. The light emitting device of claim 12 , wherein the sealing member contains a fluorescent material.
14. The light emitting device of claim 12 , wherein the light-transmitting resin is a silicone resin.
15. The light emitting device of claim 11 , wherein a through hole penetrating the substrate is formed in the peripheral area.
16. The light emitting device of claim 11 , wherein the substrate is shaped as one of a hexagon, a rectangle and a square.
17. The light emitting device of claim 11 , wherein the substrate has a thickness of about 1 mm.
18. The light emitting device of claim 11 , wherein a hole having a cut-out shape and penetrating the substrate is formed in the peripheral area.
19. The light emitting device of claim 11 , wherein the positive electrode land is large in width than the first lead-out wiring pattern, and the negative electrode land is large in width than the second lead-out wiring pattern.