Hybrid PCB with multi-unreinforced laminate

1. A hybrid printed circuit board comprising:

a top layer;

a bottom layer;

a plurality of internal layers stacked up between the top layer and the bottom layer, the plurality of internal layers including a first internal layer below the top layer and a second internal layer above the bottom layer;

first unreinforced laminate placed between the top layer and the first internal layer;

second unreinforced laminate placed between the second internal layer and the bottom layer;

third laminate placed between adjacent internal layers of the plurality of internal layers; and

traces on at least one of a top side or a bottom side of the hybrid printed circuit board, wherein the traces each have a width less than 75 micrometers.

2. The hybrid printed circuit board of claim 1 , wherein the first unreinforced laminate and the second unreinforced laminate include glass-free dielectric material.

3. The hybrid printed circuit board of claim 1 , wherein the first unreinforced laminate and the second unreinforced laminate include one of glass-free polyimide, liquid crystal polymer, and ZetaLam.

4. The hybrid printed circuit board of claim 1 , wherein the third laminate includes reinforced laminate.

5. The hybrid printed circuit board of claim 4 , wherein the reinforced laminate includes glass-reinforced epoxy laminate.

6. The hybrid printed circuit board of claim 5 , wherein the glass-reinforced epoxy laminate includes flame retardant 4 (FR-4).

7. The hybrid printed circuit board of claim 4 , wherein the reinforced laminate includes Megtron VI.

8. The hybrid printed circuit board of claim 4 , wherein the reinforced laminate includes pre-impregnated (PREPREG) composite fibers.

9. The hybrid printed circuit board of claim 1 , wherein a surface finish of the hybrid printed circuit board includes palladium.

10. A hybrid printed circuit board comprising:

a top layer;

a bottom layer;

a plurality of internal layers stacked up between the top layer and the bottom layer, the plurality of internal layers including a first internal layer below the top layer and a second internal layer above the bottom layer;

first unreinforced laminate placed between the top layer and the first internal layer;

second unreinforced laminate placed between the second internal layer and the bottom layer; and

third laminate placed between adjacent internal layers of the plurality of internal layers;

wherein a surface finish of the hybrid printed circuit board includes palladium and a thickness of the palladium is about 0.5 micrometer.

11. The hybrid printed circuit board of claim 9 , wherein the surface finish comprises electroless nickel electroless palladium immersion gold (ENEPIG) surface finish.

12. A hybrid printed circuit board comprising:

a top copper-foil layer;

a bottom copper-foil layer;

a plurality of internal copper-foil layers stacked up between the top copper-foil layer and the bottom copper-foil layer, the plurality of internal copper-foil layers including a first internal copper-foil layer below the top copper-foil layer and a second internal copper-foil layer above the bottom copper-foil layer;

first unreinforced laminate between the top copper-foil layer and the first internal copper-foil layer;

second unreinforced laminate between the second internal copper-foil layer and the bottom copper-foil layer; and

third laminate placed between adjacent internal copper-foil layers of the plurality of internal copper-foil layers.

13. The hybrid printed circuit board of claim 1 , wherein the width of each of the traces is 50 micrometers and a trace pitch of the traces is 110 micrometers.

14. The hybrid printed circuit board of claim 1 , wherein the width of each of the traces is between 50 micrometers and 60 micrometers and a trace pitch of the traces is between 100 micrometers and 110 micrometers.

15. The hybrid printed circuit board of claim 1 , wherein the hybrid printed circuit board is configured to operate at a transmission speed of at least about 25 gigabits per second per channel.

16. A hybrid printed circuit board comprising:

a top layer;

a bottom layer;

a plurality of internal layers stacked up between the top layer and the bottom layer, the plurality of internal layers including a first internal layer below the top layer and a second internal layer above the bottom layer;

first unreinforced laminate placed between the top layer and the first internal layer;

second unreinforced laminate placed between the second internal layer and the bottom layer; and

third laminate placed between adjacent internal layers of the plurality of internal layers;

wherein the hybrid printed circuit board has a thickness of 1 millimeter with a deviation between −10% to +10%.

17. The hybrid printed circuit board of claim 1 , wherein the hybrid printed circuit board has a total number of four copper-foil layers including the top layer, the first internal layer, the second internal layer, and the bottom layer.

18. The hybrid printed circuit board of claim 1 , wherein:

the hybrid printed circuit board has a total number of eight layers including the top layer, the bottom layer, and six internal layers stacked up between the top layer and the bottom layer; and

the six internal layers include the first internal layer, the second internal layer, and four additional internal layers stacked up between the first internal layer and the second internal layer.

19. The hybrid printed circuit board of claim 1 , wherein:

the hybrid printed circuit board has a total number of ten layers including the top layer, the bottom layer, and eight internal layers stacked up between the top layer and the bottom layer; and

the eight internal layers includes the first internal layer, the second internal layer, and six additional internal layers stacked up between the first internal layer and the second internal layer.

20. The hybrid printed circuit board of claim 1 , wherein a thickness of each of the first unreinforced laminate and the second unreinforced laminate is about 37 micrometers.