IP Library Granted Patent US 9,028,048
Granted Patent B2
US 9,028,048 · App. 14/249,051 · Granted May 12, 2015

Printhead assembly incorporating ink distribution assembly

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Quick Facts
Patent No.
US 9,028,048
App. No.
14/249,051
Granted
May 12, 2015
Kind
B2
Abstract

A printhead assembly includes an ink distribution assembly including an ink distribution molding, the ink distribution molding including a plurality of first ducts; at least one printhead integrated circuit in fluid communication with the ink distribution assembly; and a rotary platen having at least three surface, each surface for providing one of a platen surface, capping portion, and a blotting portion. The ink distribution assembly further includes a plurality of second ducts acutely angled with respect to the plurality of first ducts, a plurality of transfer ports facilitating fluid communication between the plurality of first ducts and the plurality of second ducts, and a plurality of ink inlet ports facilitating fluid communication between an ink cassette and the plurality of first ducts.

Claims (12)

1. A printhead assembly comprising:

an ink distribution assembly including an ink distribution molding, the ink distribution molding including a plurality of first ducts extending substantially along a longitudinal length of the ink distribution molding;

a plurality of ink inlet ports facilitating fluid communication between a plurality of ink cartridges and the plurality of first ducts;

a plurality of printhead chips in fluid communication with the ink distribution assembly; and

a laminated stack for receiving ink from the ink distribution molding and distributing ink to the plurality printhead chips, the laminated stack comprising a plurality of laminate layers,

wherein an inlet layer of the laminated stack has a plurality of ink inlet holes in fluid communication with the first ducts via a plurality of second ducts defined in the ink distribution molding, and wherein the second ducts are not parallel with the first ducts.

2. The printhead assembly as claimed in claim 1 , further comprising a plurality of flexible connectors providing electrical signals to the plurality of printhead chips.

3. The printhead assembly as claimed in claim 1 , wherein the laminated stack defines a plurality of ink channels for directing ink from the plurality of second ducts to a plurality of slots supplying ink to the plurality of printhead chips.

4. The printhead assembly of claim 3 , wherein the slots are parallel with one another.

5. The printhead assembly of claim 1 , wherein each layer of the laminated stack is a micro-molded plastics layer.

6. The printhead assembly of claim 1 , wherein each printhead chip is configured for receiving for receiving a plurality of different colored inks.

7. The printhead assembly of claim 1 , wherein the printhead chips are arranged in an overlapping array.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2014
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 033037/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2014
From: SILVERBROOK RESEARCH PTY LTD
To: ZAMTEC LIMITED
Reel/Frame 033037/0288 →