Low Emissivity Glass Incorporating Phosphorescent Rare Earth Compounds
Methods, and coated panels fabricated from the methods, are disclosed to form multiple coatings, (e.g., one or more infrared reflective layers), with minimal color change before and after heat treatments. The optical properties of the coating (e.g. the transmissivity and the IR emissivity) are generally coupled. In some embodiments, silicate materials are doped with rare earth elements. These doped silicate materials are able to absorb ultra-violet (UV) photons and emit photons in the visible range. This allows the transmissivity to be at least partially decoupled from the IR emissivity of the coated panel, resulting in a larger range of performance.
1 . A method for making a coated article, the method comprising:
forming a first layer above a first surface of a substrate, wherein the first layer consists of a rare earth-doped silicate;
forming a second layer above a second surface of the substrate, wherein the second layer comprises silicon nitride, wherein the second layer is operable as a lower protective layer;
forming one or more IR reflective stacks above the second layer, wherein each of the IR reflective stacks comprises a base oxide layer, a seed layer, an IR reflective layer, and a barrier layer;
forming a third layer above the one or more IR reflective stacks, wherein the third layer comprises zinc, tin, and oxygen, wherein the third layer is operable as an upper oxide layer;
forming a fourth layer above the third layer, wherein the fourth layer comprises zinc, and oxygen, wherein the fourth layer is operable as an optical filler layer; and
forming a fifth layer above the fourth layer, wherein the fifth layer comprises silicon nitride, wherein the fifth layer is operable as an upper protective layer.
2 . A method as in claim 1 wherein a rare earth dopant in the first layer is at least one of Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, or Y.
3 . A method as in claim 2 wherein a rare earth dopant in the first layer is at least one of Tb or Dy.
4 . A method as in claim 1 wherein the second surface of the substrate is on a side of the substrate opposite the first surface.
5 . A method as in claim 4 wherein the first layer is formed directly on the first surface of the substrate.
6 . A method as in claim 1 wherein a thickness of the first layer is between 100 nm and 1 um.
7 . A method as in claim 1 wherein the first layer is formed by a wet deposition technique or a dry deposition technique.
8 . A method as in claim 7 wherein the wet deposition technique comprises one of slurries, inks, pastes, or sol-gel.
9 . A method as in claim 7 wherein the dry deposition technique comprises one of physical vapor deposition (PVD), evaporation, pulsed laser deposition (PLD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), plasma enhanced atomic layer deposition (PEALD).
10 . A method as in claim 9 wherein the dry deposition technique comprises one of physical vapor deposition (PVD).
11 . A method as in claim 1 wherein:
the base oxide layer comprises zinc, tin, and oxygen;
wherein the reflective layer comprises silver; and
wherein the barrier layer comprises nickel, titanium, niobium, and oxygen.
12 . A method as in claim 1 further comprising forming a protective layer above the first layer, wherein the protective layer comprises one of silicon nitride, a metal nitride, or a metal oxide.
13 . A method as in claim 5 wherein the substrate consists of glass, polyimide, plastic, or polyethylene terephthalate (PET).
14 - 20 . (canceled)
21 . A method for making a coated article, the method comprising:
providing a substrate, wherein the substrate comprises a first surface and a second surface, the second surface of the substrate being on a side of the substrate opposite the first surface;
forming a first layer directly on the first surface of the substrate, wherein the first layer consists of a silicate doped with at least one rare earth element;
forming a second layer above the second surface of the substrate, wherein the second layer comprises silicon nitride;
forming one or more IR reflective stacks above the second layer, wherein each of the IR reflective stacks comprises a base oxide layer, a seed layer, an IR reflective layer, and a barrier layer;
forming a third layer above the one or more IR reflective stacks, wherein the third layer comprises zinc, tin, and oxygen;
forming a fourth layer above the third layer, wherein the fourth layer comprises zinc, and oxygen; and
forming a fifth layer above the fourth layer, wherein the fifth layer comprises silicon nitride.
22 . A method as in claim 21 wherein the at least one rare earth element comprises at least one of Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, or Y.
23 . A method as in claim 22 wherein the at least one rare earth element comprises at least one of Tb or Dy.
24 . A method as in claim 21 wherein the substrate consists of glass, polyimide, plastic, or polyethylene terephthalate (PET).
25 . A method as in claim 21 wherein the second layer is formed directly on the second surface of the substrate.
26 . A method as in claim 25 wherein the one or more IR reflective stacks is formed directly on the second layer.