IP Library Patent Application 14251638
Patent Application
App. No. 14/251,638

WELDABILITY OF ALUMINUM ALLOYS

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Quick Facts
Patent No.
US None
App. No.
14/251,638
Abstract

A method is provided for modifying a surface of a first, relatively difficult-to-weld metal substrate in preparation for a subsequent joining method by applying a thin layer of a second, relatively easy-to-weld metal to the surface of the first metal substrate.

Claims (30)

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21 . An electrochemical cell comprising;

an anode presenting a conductive layer defining a first surface, an active layer extending from said conductive layer, said conductive layer extending beyond said active layer of said anode,

a cathode presenting a conductive layer defining a second surface, an active layer extending from said conductive layer of said cathode, said conductive layer of said cathode extending beyond said active layer of said cathode,

a separator extending between said cathode and said anode;

a line electrically couples said cathode and said anode through a first lead and a second lead extending between said line and said cathode and said anode; and

a pair of metal layers connected to each of said conductive layers of said cathode and said anode and extending between said conductive layers of said cathode and said anode and said first lead and said second lead extending between said line and said cathode and said anode with each of said metal layers is connected to each of said conductive layers of said cathode and said anode through a cold deposition whereby each of said metal layers is formed from metal powder particles forming said metal layers with some of said metal powder particles embedded into each of said conductive layers of said anode and said cathode extending beyond said first surface of said anode and said second surface of said cathode.

22 . The electrochemical cell as set forth in claim 21 , wherein said conductive layer comprises an aluminum or an aluminum alloy.

23 . The electrochemical cell as set forth in claim 21 , wherein each said metal layer has a thickness of at least 20 nm and at least 20 microns.

24 . The electrochemical cell as set forth in claim 21 , wherein each said metal layer has at least one of a circular configuration and a non-circular configuration.

25 . The electrochemical cell as set forth in claim 21 , wherein each said metal layer is selected from a group of metals and metal alloys consisting of a copper, a tin, a lead, a magnesium, a bronze, a brass, a tin-zinc, a tin-antimony, a Bi, and combination thereof.