IP Library Patent Application 14255740
Patent Application
App. No. 14/255,740

ALLOYS WITH LOW COEFFICIENT OF THERMAL EXPANSION AS PDC CATALYSTS AND BINDERS

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Quick Facts
Patent No.
US None
App. No.
14/255,740
Abstract

A cutting table includes a lattice structure and a catalyst material deposited within voids formed within the lattice structure. The catalyst material is deposited in the voids during a sintering process that forms the lattice structure. The catalyst material facilitates the growth of the lattice structure. The catalyst material has a coefficient of thermal expansion that is less than that of cobalt.

Claims (27)

1 . A cutting table, comprising:

a lattice structure forming interstitial spaces therein; and

a catalyst material deposited within the interstitial spaces during a sintering process that forms the lattice structure, the catalyst material facilitating the growth of the lattice structure, the catalyst material having a coefficient of thermal expansion that is less than the coefficient of thermal expansion of cobalt.

2 . The cutting table of claim 1 , wherein the catalyst material is selected from a group consisting of chromium, tantalum, and ruthenium.

3 . The cutting table of claim 1 , wherein the catalyst material is selected from a group consisting of alloys of cobalt, alloys of a Group VIII metal and at least one non-catalyst metal, and alloys of two or more Group VIII metals.

4 . The cutting table of claim 1 , wherein the catalyst material comprises a eutectic alloy, the eutectic alloy comprising a eutectic composition.

5 . The cutting table of claim 1 , wherein the catalyst material comprises a near eutectic alloy.

6 . The cutting table of claim 1 , wherein the catalyst material has a thermal conductivity that is greater than the thermal conductivity of cobalt.

7 . The cutting table of claim 1 , wherein the lattice structure comprises a polycrystalline diamond.

8 . A cutter, comprising:

a substrate comprising a top surface;

a cutting table, comprising:

a cutting surface;

an opposing surface coupled to the top surface;

a cutting table outer wall extending from the circumference of the opposing surface to the circumference of the cutting surface;

a lattice structure forming interstitial spaces therein; and

a catalyst material deposited within the interstitial spaces during a sintering process that forms the lattice structure, the catalyst material facilitating the growth of the lattice structure, the catalyst material having a coefficient of thermal expansion that is less than the coefficient of thermal expansion of cobalt.

9 . The cutter of claim 8 , wherein the catalyst material is selected from a group consisting of chromium, tantalum, and ruthenium.

10 . The cutter of claim 8 , wherein the catalyst material is selected from a group consisting of alloys of cobalt, alloys of a Group VIII metal and at least one non-catalyst metal, and alloys of two or more Group VIII metals.

11 . The cutter of claim 8 , wherein the catalyst material comprises a eutectic alloy, the eutectic alloy comprising a eutectic composition.

12 . The cutter of claim 8 , wherein the catalyst material comprises a near eutectic alloy.

13 . The cutter of claim 8 , wherein the catalyst material has a thermal conductivity that is greater than the thermal conductivity of cobalt.

14 . The cutter of claim 8 , wherein the lattice structure comprises a polycrystalline diamond.

15 . The cutter of claim 8 , wherein the substrate is formed from a substrate powder and a binder material, the binder material cementing the substrate powder to form the substrate, the binder material being the same as the catalyst material.

16 . The cutter of claim 15 , wherein the catalyst material originates in the substrate and infiltrates into the cutting table.

17 . The cutter of claim 8 , wherein the substrate is formed from a substrate powder and a binder material, the binder material cementing the substrate powder to form the substrate, the binder material being different than the catalyst material.

18 . The cutter of claim 17 , wherein the melting point of the catalyst material is lower than the melting point of the binder material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2015
From: THIGPEN, GARY M.; KING, WILLIAM W.
To: VAREL INTERNATIONAL IND., L.P.
Reel/Frame 036378/0195 →