IP Library Granted Patent US 10,009,993
Granted Patent B2
US 10,009,993 · App. 14/256,610 · Granted Jun 26, 2018

Circuit board reflow of components using on board copper traces as heating element

Inventors: Paul L. Pankratz (Sandy, OR); Curtis Douglass Keller (West Linn, OR)
Assignee: XEROX CORPORATION
H05K1/0212H05K1/0292H05K1/167H05K2203/176
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Quick Facts
Patent No.
US 10,009,993
App. No.
14/256,610
Granted
Jun 26, 2018
Kind
B2
Abstract

An electronic circuit board has at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connected to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow. An electronic circuit board system has an electronic circuit board. The electronic circuit board includes at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connection to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads with reflow, and a heater to connect to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow.

Claims (11)

1. An electronic circuit board system, comprising:

an electronic circuit board, having:

at least one heater trace internal to a substrate of the electronic circuit board;

at least one array of contact pads on the surface of the substrate, wherein the contact pads are of re-flowable material;

a heater connection electrically coupled to the heater trace, such that when current is applied to the heater trace at least a region of the substrate adjacent the array of contact pads heats up to a temperature to cause the re-flowable material of the contact pads to reflow; and

a heater to connect to the heater connection and apply current to the heater trace.

2. The system of claim 1 , wherein the heater is located on the electronic circuit board.

3. The system of claim 1 , wherein the heater is an external heater to the electronic circuit board.

4. The system of claim 1 , wherein the heater connection comprises a copper trace having a length sufficient to provide a resistance that causes the trace to generate heat.

5. The system of claim 3 , wherein the external heater includes a microcontroller.

6. The system of claim 3 , wherein the external heater has a connector adapted to connect to the heater trace on the circuit board.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2025
From: XEROX CORPORATION
To: GENESEE VALLEY INNOVATIONS, LLC
Reel/Frame 073842/0479 →
SECOND LIEN NOTES PATENT SECURITY AGREEMENT Recorded Jul 2, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 071785/0550 →
FIRST LIEN NOTES PATENT SECURITY AGREEMENT Recorded Apr 11, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 070824/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT RF 064760/0389 Recorded Feb 13, 2024
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: XEROX CORPORATION
Reel/Frame 068261/0001 →
SECURITY INTEREST Recorded Feb 13, 2024
From: XEROX CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 066741/0001 →
SECURITY INTEREST Recorded Nov 20, 2023
From: XEROX CORPORATION
To: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 065628/0019 →
SECURITY INTEREST Recorded Jun 22, 2023
From: XEROX CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 064760/0389 →
RELEASE OF SECURITY INTEREST IN PATENTS AT R/F 062740/0214 Recorded May 18, 2023
From: CITIBANK, N.A., AS AGENT
To: XEROX CORPORATION
Reel/Frame 063694/0122 →
SECURITY INTEREST Recorded Nov 10, 2022
From: XEROX CORPORATION
To: CITIBANK, N.A., AS AGENT
Reel/Frame 062740/0214 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2014
From: KELLER, CURTIS DOUGLASS; PANKRATZ, PAUL L.
To: XEROX CORPORATION
Reel/Frame 032710/0376 →
Continuity (1)
Related Publication 20150305140A1 · Oct 22, 2015