Semiconductor power device
View Patent ↗A semiconductor power device, comprising: a substrate; a first semiconductor layer with a first lattice constant formed on the substrate; a first grading layer formed on the first semiconductor layer and comprising a first portion; a second grading layer formed on the first grading layer; a second semiconductor layer with a second lattice constant formed on the second grading layer; a first interlayer formed in the first grading layer and adjacent to the first portion of the first grading layer; and a second interlayer formed in the second grading layer; wherein the first interlayer comprises a first superlattice including a series of Al x1 Ga 1-x1 N/Al y1 Ga 1-y1 N alternate layers, (x1-y1)≧0.2, and the second interlayer comprises a second superlattice including a series of Al x2 Ga 1-x2 N/Al y2 Ga 1-y2 N alternate layers, (x2-y2)≧0.2, wherein the average of x1 and y1 is larger than that of x2 and y2.
1. A semiconductor power device, comprising:
a substrate;
a first semiconductor layer with a first lattice constant formed on the substrate;
a first grading layer formed on the first semiconductor layer and comprising a first portion;
a second grading layer formed on the first grading layer;
a second semiconductor layer with a second lattice constant formed on the second grading layer;
a first interlayer formed in the first grading layer and adjacent to the first portion of the first grading layer; and
a second interlayer formed in the second grading layer;
wherein the first interlayer comprises a first superlattice including a series of Al x1 Ga 1-x1 N/Al y1 Ga 1-y1 N alternate layers, (x1-y1)≧0.2, and the second interlayer comprises a second superlattice including a series of Al x2 Ga 1-x2 N/Al y2 Ga 1-y2 N alternate layers, (x2-y2≧0.2, wherein the average of x1 and y1 is larger than that of x2 and y2.
2. The semiconductor power device according to claim 1 , wherein the thickness of the Al x1 Ga 1-x1 N/Al y1 Ga 1-y1 N layer is between 1 nm and 100 nm.
3. The semiconductor power device according to claim 1 , wherein the first grading layer further comprises a second portion opposite to the first portion adjacent to the first interlayer.
4. The semiconductor power device according to claim 3 , wherein the first portion and the second portion comprise Al a Ga 1-a N and Al b Ga 1-b N respectively, and x>a=b>y.
5. The semiconductor power device according to claim 3 , wherein the first portion and the second portion comprise Al a Ga 1-a N and Al b Ga 1-b N respectively, and a>x>y>b, or x>a>b>y.
6. The semiconductor power device according to claim 1 , wherein the first lattice constant is smaller than the second lattice constant.
7. The semiconductor power device according to claim 1 , wherein the first interlayer has a lattice constant, and the lattice constant is between the first lattice constant and the second lattice constant.
8. The semiconductor power device according to claim 1 , wherein the first grading layer and the second grading layer comprise AlGaN or AlGaInN, and the first interlayer and the second interlayer comprise an amorphous material.
9. The semiconductor power device according to claim 8 , wherein the amorphous material comprises SiN.
10. The semiconductor power device according to claim 1 , wherein the first semiconductor layer comprises a first group III element, the second semiconductor layer comprises a second group III element, the first grading layer comprises the first group III element and the second group III element, and concentrations of both the first group III element and the second group III element in the first grading layer are gradually changed.
11. The semiconductor power device according to claim 10 , wherein the second grading layer comprises the first group III element and the second group III element, wherein concentrations of both of the first group III element and the second group III element in the second grading layer are gradually changed.
12. The semiconductor power device according to claim 11 , wherein a lattice constant of the second grading layer is larger than the lattice constant of the first grading layer.
13. The semiconductor power device according to claim 1 , wherein the Al x1 Ga 1-x1 N layer is closer to the substrate than the Al y1 Ga 1-y1 N layer.