IP Library Granted Patent US 9,307,665
Granted Patent B2
US 9,307,665 · App. 14/257,768 · Granted Apr 5, 2016

Electrical component packaging

Inventors: Michael Asis (Nijmegen, NL); Albertus Reijs (Eindhoven, NL); Tennyson Nguty (Newcastle, GB); An Xiao (Den Bosch, NL)
Assignee: SAMBA HOLDCO NETHERLANDS B.V.
H05K7/02H01L23/057H01L23/10H01L23/49541H01L2224/48091H01L2224/48247H01L2924/16152
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Quick Facts
Patent No.
US 9,307,665
App. No.
14/257,768
Granted
Apr 5, 2016
Kind
B2
Abstract

The invention provides an air cavity package for a component. The package has a connection lead structure in which the or each connection lead has a connection zone within the package for receiving a wire connector. A region of no connection lead material is provided directly between the connection zone and the neighboring outer edge of the cavity. This provides a trap for flowing interconnect material.

Claims (27)

1. An air cavity package for an electrical component, wherein the package comprises a base, a first set of layers forming an enclosure, a connection lead structure formed over the first set of layers for connecting to the component within the package and having connection terminals outside the package, a bond layer over the connection lead structure and a lid over the bond layer, wherein the inner surface of the lid defines the limit of air cavity,

wherein the connection lead structure comprises at least one connection lead having a connection zone within the package for receiving a wire connector, wherein a region of no connection lead material is provided directly between the connection zone and the neighbouring outer edge of the air cavity defined by the lid;

wherein the connection lead comprises a leg region beneath the lid and to the inside of the cavity, which leg region runs parallel to the local direction of the periphery of the lid;

wherein the leg region comprises the connection zone running parallel to the local direction of the periphery of the lid and a coupling part which connects between an end of the connection zone and a connection terminal outside the package;

wherein the connection zone and the coupling part form an L-shaped configuration;

comprising a return portion at the other end of the connection zone to the coupling part, wherein the connection zone, the coupling part and the return portion form C-shaped configuration.

2. A package as claimed in claim 1 , wherein the bond layer is an epoxy resin.

3. A packaged component, comprising a package as claimed in claim 1 ;

a component in the air cavity; and

a wire connector between the connection zone of the connection lead and the component.

4. An air cavity package for an electrical component, wherein the package comprises a base, a first set of layers forming an enclosure, a connection lead structure formed over the first set of layers for connecting to the component within the package and having connection terminals outside the package, a bond layer over the connection lead structure and a lid over the bond layer, wherein the inner surface of the lid defines the limit of air cavity,

wherein the connection lead structure comprises at least one connection lead having a connection zone within the package for receiving a wire connector, wherein a region of no connection lead material is provided directly between the connection zone and the neighbouring outer edge of the air cavity defined by the lid;

wherein the connection lead comprises a leg region beneath the lid and to the inside of the cavity, which leg region runs parallel to the local direction of the periphery of the lid;

wherein at least a portion of the region of no connection lead material directly between the connection zone and the neighbouring outer edge of the air cavity defined by the lid is inside the air cavity defined by the lid such that there is an opening in the connection lead structure between the inner surface of the lid and the connection zone of the at least one connection lead;

wherein the opening in the connection lead structure between the inner surface of the lid and the connection zone of the at least one connection lead is filled with the bond layer; and

wherein the leg region comprises an open slot running parallel to the local direction of the periphery of the lid, with the connection zone to the side of the slot facing into the cavity.

5. An air cavity package for an electrical component, wherein the package comprises a base, a first set of layers forming an enclosure, a connection lead structure formed over the first set of layers for connecting to the component within the package and having connection terminals outside the package, a bond layer over the connection lead structure and a lid over the bond layer, wherein the inner surface of the lid defines the limit of air cavity,

wherein the connection lead structure comprises at least one connection lead having a connection zone within the package for receiving a wire connector, wherein a region of no connection lead material is provided directly between the connection zone and the neighbouring outer edge of the air cavity defined by the lid;

wherein the connection lead comprises a leg region beneath the lid and to the inside of the cavity, which leg region runs parallel to the local direction of the periphery of the lid;

wherein at least a portion of the region of no connection lead material directly between the connection zone and the neighbouring outer edge of the air cavity defined by the lid is inside the air cavity defined by the lid such that there is an opening in the connection lead structure between the inner surface of the lid and the connection zone of the at least one connection lead;

wherein the opening in the connection lead structure between the inner surface of the lid and the connection zone of the at least one connection lead is filled with the bond layer; and

wherein the leg region comprises a closed slot running parallel to the local direction of the periphery of the lid, with the connection zone to the side of the slot facing into the cavity.

6. An air cavity package for an electrical component, wherein the package comprises a base, a first set of layers forming an enclosure, a connection lead structure formed over the first set of layers for connecting to the component within the package and having connection terminals outside the package, a bond layer over the connection lead structure and a lid over the bond layer, wherein the inner surface of the lid defines the limit of air cavity,

wherein the connection lead structure comprises at least one connection lead having a connection zone within the package for receiving a wire connector, wherein a region of no connection lead material is provided directly between the connection zone and the neighbouring outer edge of the air cavity defined by the lid;

wherein the connection lead comprises a leg region beneath the lid and to the inside of the cavity, which leg region runs parallel to the local direction of the periphery of the lid;

wherein the leg region comprises an open slot or a closed slot running parallel to the local direction of the periphery of the lid, with the connection zone to the side of the slot facing into the cavity, wherein at least a portion of the slot is inside the air cavity defined by the lid such that there is an opening in the lead structure between the inner surface of the lid and the connection zone of the at least one connection lead.

7. A package as claimed in claim 6 , wherein the opening in the connection lead structure between the inner surface of the lid and the connection zone of the at least one connection lead is filled with the bond layer.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
CHANGE OF NAME Recorded Feb 22, 2016
From: SAMBA HOLDCO NETHERLANDS B.V.
To: AMPLEON NETHERLANDS B.V.
Reel/Frame 037876/0873 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2015
From: NXP B.V.
To: SAMBA HOLDCO NETHERLANDS B.V.
Reel/Frame 036630/0574 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2014
From: ASIS, MICHAEL; REIJS, ALBERTUS; NGUTY, TENNYSON; XIAO, AN
To: NXP B.V.
Reel/Frame 032721/0232 →
Priority Claims (1)
EP 13165213 · Apr 24, 2013 · regional
Continuity (1)
Related Publication 20140318854A1 · Oct 30, 2014