Light-emitting device

1. A light-emitting device including a light-emitting element and a wavelength conversion layer, comprising:

a translucent member including:

a translucent base, and

the wavelength conversion layer formed on the translucent base, and

a frame body formed with a recess,

wherein the wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device,

the light-emitting element is mounted in the recess,

the translucent member is mounted on the frame body so as to cover the recess,

the translucent member is bonded to the frame body with an adhesive material,

a side surface of the wavelength conversion layer is covered by the adhesive material, and

a cutout is formed in an end part of the translucent base.

2. The light-emitting device of claim 1 , wherein the wavelength conversion layer contains semiconductor fluorescent particles.

3. The light-emitting device of claim 1 , wherein the cutout is filled with the adhesive material.

4. The light-emitting device of claim 1 , wherein the wavelength conversion layer contacts an upper surface of the frame body.

5. The light-emitting device of claim 1 , wherein the recess is filled with gas other than oxygen.

6. A light-emitting device including a light-emitting element and a wavelength conversion layer, comprising:

a translucent member including:

a translucent base, and

the wavelength conversion layer formed on the translucent base,

wherein the wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device,

the translucent member includes a barrier layer,

the barrier layer is formed on a side of the wavelength conversion layer opposite to the translucent base,

the wavelength conversion layer is sealed with the translucent base and the barrier layer,

the translucent base is a translucent circuit board, and

the light-emitting element is electrically connected to an interconnection formed on the translucent base.

7. The light-emitting device of claim 6 , wherein

a through-hole is formed in the translucent base,

the through-hole is filled with the wavelength conversion layer, and

a heat dissipation pattern is formed on the translucent base so as to cover the through-hole.

8. The light-emitting device of claim 6 , wherein a cured layer is formed at a side surface of the wavelength conversion layer.

9. A light-emitting device including a light-emitting element and a wavelength conversion layer, comprising:

a translucent member including:

a translucent base, and

the wavelength conversion layer formed on the translucent base,

wherein the wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device,

the translucent member includes a barrier layer,

the barrier layer is formed on a side of the wavelength conversion layer opposite to the translucent base,

the wavelength conversion layer is sealed with the translucent base and the barrier layer,

the light-emitting element is bonded to the translucent member, and

a side surface of the light-emitting element and a side surface of the translucent member are flush with each other.

10. The light-emitting device of claim 9 , wherein a heat dissipation pattern is formed on the light-emitting element.

11. The light-emitting device of claim 9 , wherein a cured layer is formed at a side surface of the wavelength conversion layer.