METHOD OF FABRICATING A CONDUCTIVE PATTERN WITH HIGH OPTICAL TRANSMISSION AND LOW VISIBILITY
A method of fabricating a conductive pattern includes disposing an image of the conductive pattern on a substrate. The image includes material capable of being electroless plated. The image is electroless plated with a first metal forming a first plated image. The first plated image is electroless plated with a second metal forming a second plated image. The second metal passivates the first metal. The second plated image is bathed in an immersion bath comprising a darkening material.
1 . A method of fabricating a conductive pattern comprising:
disposing an image of the conductive pattern on a substrate, wherein the image comprises material capable of being electroless plated;
electroless plating the image with a first metal forming a first plated image;
electroless plating the first plated image with a second metal forming a second plated image, wherein the second metal passivates the first metal; and
bathing the second plated image in an immersion bath comprising a darkening material.
2 . The method of claim 1 , further comprising rinsing the substrate with deionized water.
3 . The method of claim 1 , further comprising applying an activator to the first plated image.
4 . The method of claim 1 , wherein the image of the conductive pattern is disposed on the substrate by a flexographic printing process.
5 . The method of claim 4 , wherein the image comprises a catalytic ink.
6 . The method of claim 1 , wherein the substrate comprises polyethylene terephthalate.
7 . The method of claim 1 , wherein the conductive pattern comprises a plurality of parallel conductive lines oriented in a first direction and a plurality of parallel conductive lines oriented in a second direction.
8 . The method of claim 7 , wherein the conductive lines have a line width of less than 5 micrometers.
9 . The method of claim 7 , wherein the conductive lines have a line width in a range between approximately 5 micrometers and approximately 10 micrometers.
10 . The method of claim 1 , wherein the first metal comprises copper.
11 . The method of claim 1 , wherein the first metal comprises copper nickel alloy.
12 . The method of claim 1 , wherein the first metal comprises one or more of nickel, silver, gold, cobalt, chromium, or ruthenium.
13 . The method of claim 1 , wherein the first metal thickness is in a range between approximately 100 nanometers and approximately 3 micrometers.
14 . The method of claim 1 , wherein the first metal thickness is in a range between approximately 500 nanometers and approximately 1.5 micrometers.
15 . The method of claim 1 , wherein the first metal thickness is in a range between approximately 100 nanometers and approximately 500 nanometers.
16 . The method of claim 1 , wherein the second metal comprises nickel.
17 . The method of claim 1 , wherein the second metal comprises nickel boron alloy.
18 . The method of claim 1 , wherein the second metal comprises nickel phosphorous alloy.
19 . The method of claim 1 , wherein the second metal comprises cobalt.
20 . The method of claim 1 , wherein the second metal comprises chromium.
21 . The method of claim 1 , wherein the second metal thickness is in a range between approximately 10 nanometers and approximately 1 micrometer.
22 . The method of claim 1 , wherein the second metal thickness is in a range between approximately 100 nanometers and approximately 400 nanometers.
23 . The method of claim 1 , wherein the second metal thickness is in a range between approximately 10 nanometers and approximately 100 nanometers.
24 . The method of claim 1 , wherein the darkening material comprises palladium.
25 . The method of claim 1 , wherein the darkening material comprises ruthenium.
26 . The method of claim 1 , wherein the darkening material comprises a platinum group metal.
27 . The method of claim 1 , wherein the darkening material thickness is in a range between approximately 10 nanometers and approximately 100 nanometers.
28 . The method of claim 1 , wherein the darkening material thickness is in a range between approximately 10 nanometers and approximately 50 nanometers.
29 . The method of claim 1 , wherein the darkening material thickness is in a range between approximately 50 nanometers and approximately 100 nanometers.
30 . A method of fabricating a conductive pattern comprising:
disposing an image of the conductive pattern on a substrate, wherein the image comprises material capable of being electroless plated;
electroless plating the image with a first metal forming a first plated image;
electroless plating the first plated image with a second metal forming a second plated image, wherein the second metal passivates the first metal; and
electroless plating the second plated image with a darkening material.
31 . The method of claim 30 , further comprising rinsing the substrate with deionized water.
32 . The method of claim 30 , further comprising applying an activator to the first plated image.
33 . The method of claim 30 , further comprising applying an activator to the second plated image.
34 . The method of claim 30 , wherein the image of the conductive pattern is disposed on the substrate by a flexographic printing process.
35 . The method of claim 34 , wherein the image comprises a catalytic ink.
36 . The method of claim 30 , wherein the substrate comprises polyethylene terephthalate.
37 . The method of claim 30 , wherein the conductive pattern comprises a plurality of parallel conductive lines oriented in a first direction and a plurality of parallel conductive lines oriented in a second direction.
38 . The method of claim 37 , wherein the conductive lines have a line width of less than 5 micrometers.
39 . The method of claim 37 , wherein the conductive lines have a line width in a range between approximately 5 micrometers and approximately 10 micrometers.
40 . The method of claim 30 , wherein the first metal comprises copper.
41 . The method of claim 30 , wherein the first metal comprises copper nickel alloy.
42 . The method of claim 30 , wherein the first metal comprises one or more of nickel, silver, gold, cobalt, chromium, or ruthenium.
43 . The method of claim 30 , wherein the first metal plated thickness is in a range between approximately 100 nanometers and approximately 3 micrometers.
44 . The method of claim 30 , wherein the first metal plated thickness is in a range between approximately 500 nanometers and approximately 1.5 micrometers.
45 . The method of claim 30 , wherein the first metal plated thickness is in a range between approximately 100 nanometers and approximately 500 nanometers.
46 . The method of claim 30 , wherein the second metal comprises nickel.
47 . The method of claim 30 , wherein the second metal comprises nickel boron alloy.
48 . The method of claim 30 , wherein the second metal comprises nickel phosphorous alloy.
49 . The method of claim 30 , wherein the second metal comprises cobalt.
50 . The method of claim 30 , wherein the second metal comprises chromium.
51 . The method of claim 30 , wherein the second metal plated thickness is in a range between approximately 10 nanometers and approximately 500 nanometers.
52 . The method of claim 30 , wherein the second metal plated thickness is in a range between approximately 100 nanometers and approximately 200 nanometers.
53 . The method of claim 30 , wherein the second metal plated thickness is in a range between approximately 200 nanometers and approximately 500 nanometers.
54 . The method of claim 30 , wherein the darkening material comprises zinc.
55 . The method of claim 30 , wherein the darkening material comprises niobium.
56 . The method of claim 30 , wherein the darkening material comprises cobalt.
57 . The method of claim 30 , wherein the darkening material thickness is in a range between approximately 10 nanometers and approximately 100 nanometers.
58 . The method of claim 30 , wherein the darkening material thickness is in a range between approximately 10 nanometers and approximately 50 nanometers.
59 . The method of claim 30 , wherein the darkening material thickness is in a range between approximately 50 nanometers and approximately 100 nanometers.