Solid-state image pickup device and method for producing the same
A solid-state image pickup device includes an element isolation insulating film electrically isolating pixels on the surface of a well region; a first isolation diffusion layer electrically isolating the pixels under the element isolation insulating film; and a second isolation diffusion layer electrically isolating the pixels under the first isolation diffusion layer, wherein a charge accumulation region is disposed in the well region surrounded by the first and second isolation diffusion layers, the inner peripheral part of the first isolation diffusion layer forms a projecting region, an impurity having a conductivity type of the first isolation diffusion layer and an impurity having a conductivity type of the charge accumulation region are mixed in the projecting region, and a part of the charge accumulation region between the charge accumulation region and the second isolation diffusion layer is abutted or close to the second isolation diffusion layer under the projecting region.
1. A solid-state image pickup device comprising:
a semiconductor substrate;
a plurality of pixels respectively having a photoelectric conversion element formed in the semiconductor substrate;
an element isolation insulating film configured to electrically isolate adjacent ones of the plurality of pixels, the element isolation insulating film being formed on a surface of the semiconductor substrate; and
a first isolation diffusion configured to electrically isolate the adjacent ones of the plurality of pixels, the first isolation diffusion being formed under a portion of the element isolation insulating film having a first thickness,
wherein a part of the first isolation diffusion adjacent to the photoelectric conversion element has mixed impurities and the part of the first isolation diffusion having the mixed impurities is located entirely beneath the portion of the element isolation insulating film having the first thickness.
2. The solid-state image pickup device according to claim 1 , further comprising a lower isolation diffusion configured to electrically isolate the adjacent ones of the plurality of pixels, the lower isolation diffusion formed under the first isolation diffusion separated from an edge of the first isolation diffusion that is closest to the corresponding photoelectric conversion element.
3. The solid-state image pickup device according to claim 1 , wherein the photoelectric conversion element has a charge accumulation region.
4. The solid-state image pickup device according to claim 3 , wherein the photoelectric conversion element has an accumulation layer, and a conductivity type of the accumulation layer is different from a conductivity type of the charge accumulation region.
5. The solid-state image pickup device according to claim 1 , wherein the mixed impurities are n-type and p-type impurities.
6. The solid-state image pickup device according to claim 2 , wherein a width of the lower isolation diffusion is smaller than a width of the element isolation insulating film.
7. The solid-state image pickup device according to claim 3 , wherein the part of the first isolation diffusion having the mixed impurities is located between the element isolation insulating film and the charge accumulation region.
8. The solid-state image pickup device according to claim 1 , wherein the part of the first isolation diffusion having the mixed impurities is located between the photoelectric conversion element and a part of the first isolation diffusion not having the mixed impurities.
9. The solid-state image pickup device according to claim 1 , further comprising an insulating film between the element isolation insulating film and the first isolation diffusion.
10. The solid-state image pickup device according to claim 1 , wherein the semiconductor substrate is a silicon substrate.
11. An image sensor comprising:
a pixel area, including:
a semiconductor substrate,
a plurality of pixels respectively having a photoelectric conversion element formed in the semiconductor substrate,
an element isolation insulating film configured to electrically isolate adjacent ones of the plurality of pixels, the element isolation insulating film being formed on a surface of the semiconductor substrate, and
a first isolation diffusion configured to electrically isolate the adjacent ones of the plurality of pixels, the first isolation diffusion being formed under a portion of the element isolation insulating film having a first thickness; and
peripheral circuits configured to drive the pixel area,
wherein a part of the first isolation diffusion adjacent to the photoelectric conversion element has mixed impurities and the part of the first isolation diffusion having the mixed impurities is located entirely beneath the portion of the element isolation insulating film having the first thickness.
12. The image sensor according to claim 11 , further comprising a lower isolation diffusion configured to electrically isolate the adjacent ones of the plurality of pixels, the lower isolation diffusion formed under the first isolation diffusion separated from an edge of the first isolation diffusion that is closest to the corresponding photoelectric conversion element.
13. The image sensor according to claim 12 , wherein a width of the lower isolation diffusion is smaller than a width of the element isolation insulating film.
14. The image sensor according to claim 11 , wherein the photoelectric conversion element has a charge accumulation region.
15. The image sensor according to claim 14 , wherein the photoelectric conversion element has an accumulation layer, and a conductivity type of the accumulation layer is different from a conductivity type of the charge accumulation region.
16. The image sensor according to claim 14 , wherein the part of the first isolation diffusion having the mixed impurities is located between the element isolation insulating film and the charge accumulation region.
17. The image sensor according to claim 11 , wherein the mixed impurities are n-type and p-type impurities.
18. The image sensor according to claim 11 , wherein the part of the first isolation diffusion having the mixed impurities is located between the photoelectric conversion element and a part of the first isolation diffusion not having the mixed impurities.
19. The image sensor according to claim 11 , further comprising an insulating film between the element isolation insulating film and the first isolation diffusion.
20. The image sensor according to claim 11 , wherein the semiconductor substrate is a silicon substrate.