METHOD OF FABRICATING A CONDUCTIVE PATTERN WITH HIGH OPTICAL TRANSMISSION, LOW REFLECTANCE, AND LOW VISIBILITY
A method of fabricating a conductive pattern includes disposing an image of the conductive pattern on a substrate. The image includes material capable of being electroless plated. The image is electroless plated with a first metal forming a plated image. The first metal includes copper. The plated image is bathed in an immersion bath that includes a metal ion source of a second metal that reacts with the first metal. The second metal includes palladium. The conductive pattern includes a first metal layer having a first metal thickness, an intermetallic first metal-second metal interface layer, and a second metal layer having a second metal thickness.
1 . A method of fabricating a conductive pattern comprising:
disposing an image of the conductive pattern on a substrate, wherein the image comprises material capable of being electroless plated;
electroless plating the image with a first metal forming a plated image, wherein the first metal comprises copper; and
bathing the plated image in an immersion bath comprising a metal ion source of a second metal that reacts with the first metal, wherein the second metal comprises palladium,
wherein the conductive pattern comprises a first metal layer having a first metal thickness, an intermetallic first metal-second metal interface layer, and a second metal layer having a second metal thickness.
2 . The method of claim 1 , further comprising rinsing the substrate with deionized water.
3 . The method of claim 1 , further comprising disposing an organic protection layer on exposed portions of the second metal.
4 . The method of claim 1 , wherein the image of the conductive pattern is disposed on the substrate by a flexographic printing process.
5 . The method of claim 4 , wherein the image comprises a catalytic ink.
6 . The method of claim 1 , wherein the substrate comprises polyethylene terephthalate.
7 . The method of claim 1 , wherein the conductive pattern comprises a plurality of parallel conductive lines oriented in a first direction and a plurality of parallel conductive lines oriented in a second direction.
8 . The method of claim 7 , wherein the conductive lines have a line width of less than 5 micrometers.
9 . The method of claim 7 , wherein the conductive lines have a line width in a range between approximately 5 micrometers and approximately 10 micrometers.
10 . The method of claim 1 , wherein the first metal comprises copper nickel alloy.
11 . The method of claim 1 , wherein the first metal comprises one or more of nickel, silver, gold, cobalt, chromium, or ruthenium.
12 . The method of claim 1 , wherein the first metal thickness is in a range between approximately 50 nanometers and approximately 3 micrometers.
13 . The method of claim 1 , wherein the first metal thickness is in a range between approximately 500 nanometers and approximately 1.5 micrometers.
14 . The method of claim 1 , wherein the first metal thickness is in a range between approximately 100 nanometers and approximately 500 nanometers.
15 . The method of claim 1 , wherein the second metal comprises compounds containing palladium.
16 . The method of claim 1 , wherein the second metal comprises one or more platinum group metals.
17 . The method of claim 1 , wherein the second metal thickness is in a range between approximately 1 nanometer and approximately 100 nanometers.
18 . The method of claim 1 , wherein the second metal thickness is in a range between approximately 10 nanometers and approximately 50 nanometers.
19 . The method of claim 1 , wherein the second metal thickness is in a range between approximately 10 nanometers and approximately 30 nanometers.
20 . A method of fabricating a conductive pattern comprising:
disposing an image of the conductive pattern on a substrate, wherein the image comprises material capable of being electroless plated;
electroless plating the image with a first metal forming a plated image, wherein the first metal comprises copper having a first plated thickness; and
electroless plating the plated image with a second metal, wherein the second metal comprises palladium having a second plated metal thickness.
21 . The method of claim 20 , further comprising rinsing the substrate with deionized water.
22 . The method of claim 20 , further comprising disposing an organic protection layer on exposed portions of the second metal.
23 . The method of claim 20 , wherein the image of the conductive pattern is disposed on the substrate by a flexographic printing process.
24 . The method of claim 20 , wherein the image comprises a catalytic ink.
25 . The method of claim 20 , wherein the substrate comprises polyethylene terephthalate.
26 . The method of claim 20 , wherein the conductive pattern comprises a plurality of parallel conductive lines oriented in a first direction and a plurality of parallel conductive lines oriented in a second direction.
27 . The method of claim 26 , wherein the conductive lines have a line width of less than 5 micrometers.
28 . The method of claim 26 , wherein the conductive lines have a line width in a range between approximately 5 micrometers and approximately 10 micrometers.
29 . The method of claim 20 , wherein the first metal comprises copper nickel alloy.
30 . The method of claim 20 , wherein the first metal comprises one or more of nickel, silver, gold, cobalt, chromium, or ruthenium.
31 . The method of claim 20 , wherein the first metal plated thickness is in a range between approximately 50 nanometers and approximately 3 micrometers.
32 . The method of claim 20 , wherein the first metal plated thickness is in a range between approximately 500 nanometers and approximately 1.5 micrometers.
33 . The method of claim 20 , wherein the first metal plated thickness is in a range between approximately 100 nanometers and approximately 500 nanometers.
34 . The method of claim 20 , wherein the second metal comprises compounds containing palladium.
35 . The method of claim 20 , wherein the second metal comprises one or more platinum group metals.
36 . The method of claim 20 , wherein the second metal plated thickness is in a range between approximately 1 nanometer and approximately 100 nanometers.
37 . The method of claim 20 , wherein the second metal plated thickness is in a range between approximately 10 nanometers and approximately 50 nanometers.
38 . The method of claim 20 , wherein the second metal plated thickness is in a range between approximately 10 nanometers and approximately 30 nanometers.