IP Library Granted Patent US 9,419,569
Granted Patent B2
US 9,419,569 · App. 14/260,214 · Granted Aug 16, 2016

Method and system for a pseudo-differential low-noise amplifier at Ku-band

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Quick Facts
Patent No.
US 9,419,569
App. No.
14/260,214
Granted
Aug 16, 2016
Kind
B2
Abstract

Methods and systems for a pseudo-differential low-noise amplifier at Ku-band may comprise a low-noise amplifier (LNA) integrated on a semiconductor die, where the LNA comprises differential pair transistors with an embedded inductor tail integrated on the semiconductor die. The embedded inductor tail may comprise: a first inductor with a first terminal capacitively-coupled to a gate terminal of a first transistor of the differential pair transistors and a second terminal of the first inductor coupled to second, third, and fourth inductors. The second inductor may be coupled to a source terminal of the first transistor of the differential pair transistors, the fourth inductor may be coupled to a source terminal of the second transistor of the differential pair transistors, and the third inductor may be capacitively-coupled to a gate terminal of the second transistor of the differential pair transistors and also to ground. The second inductor may be embedded within the first inductor.

Claims (26)

1. A semiconductor device, the device comprising:

a low-noise amplifier (LNA) integrated on a semiconductor die, the LNA comprising differential pair transistors with an embedded inductor tail integrated on the semiconductor die, wherein the embedded inductor tail comprises:

a first inductor with a first terminal capacitively-coupled to a gate terminal of a first transistor of the differential pair transistors and a second terminal of the first inductor coupled to second, third, and fourth inductors, wherein the second inductor is coupled to a source terminal of the first transistor of the differential pair transistors, the fourth inductor is coupled to a source terminal of the second transistor of the differential pair transistors, and the third inductor is capacitively-coupled to a gate terminal of the second transistor of the differential pair transistors and also to ground.

2. The device according to claim 1 , wherein the second inductor is embedded within the first inductor.

3. The device according to claim 1 , wherein the fourth inductor is embedded within the third inductor.

4. The device according to claim 1 , wherein cascode transistors are coupled to drain terminals of the differential pair transistors.

5. The device according to claim 4 , wherein the cascode transistors have inductive loads comprising inductors integrated on the semiconductor die.

6. The device according to claim 4 , wherein the differential pair transistors and the cascode transistors comprise complementary metal-oxide semiconductor (CMOS) transistors.

7. The device according to claim 1 , wherein the first inductor is capacitively-coupled to the gate of the first transistor of the differential pair transistors and the fourth inductor is capacitively-coupled to the gate of the second transistor of the differential pair transistors utilizing CMOS capacitors.

8. The device according to claim 1 , wherein the LNA is operable to receive a single-ended signal and generate a differential output signal.

9. The device according to claim 1 , wherein the embedded inductor tail is operable to provide electro-static discharge (ESD) protection for the LNA.

10. The device according to claim 1 , wherein the semiconductor die is bonded to a packaging substrate.

11. A method for communication, the method comprising:

in a low-noise amplifier (LNA) integrated on a semiconductor die, the LNA comprising differential pair transistors with an embedded inductor tail integrated on the semiconductor die, amplifying a radio frequency (RF) signal, wherein the embedded inductor tail comprises:

a first inductor with a first terminal capacitively-coupled to a gate terminal of a first transistor of the differential pair transistors and a second terminal of the first inductor coupled to second, third, and fourth inductors, wherein the second inductor is coupled to a source terminal of the first transistor of the differential pair transistors, the fourth inductor is coupled to a source terminal of the second transistor of the differential pair transistors, and the third inductor is capacitively-coupled to a gate terminal of the second transistor of the differential pair transistors and also to ground.

12. The method according to claim 11 , wherein the second inductor is embedded within the first inductor.

13. The method according to claim 11 , wherein the fourth inductor is embedded within the third inductor.

14. The method according to claim 11 , wherein cascode transistors are coupled to drain terminals of the differential pair transistors.

15. The method according to claim 14 , wherein the cascode transistors have inductive loads comprising inductors integrated on the semiconductor die.

16. The method according to claim 14 , wherein the differential pair transistors and the cascode transistors comprise complementary metal-oxide semiconductor (CMOS) transistors.

17. The method according to claim 11 , wherein the first inductor is capacitively-coupled to the gate of the first transistor of the differential pair transistors and the fourth inductor is capacitively-coupled to the gate of the second transistor of the differential pair transistors utilizing CMOS capacitors.

18. The method according to claim 17 , comprising generating a differential output signal from the received RF signal using the LNA.

19. The method according to claim 11 , comprising electro-static discharge (ESD) protection for the LNA utilizing the embedded inductor tail.

20. A semiconductor device comprising:

a low-noise amplifier (LNA) integrated on a complementary metal-oxide semiconductor (CMOS) die, the LNA comprising differential pair transistors with an embedded inductor tail integrated on the semiconductor die, wherein the embedded inductor tail comprises:

a first inductor with a first terminal capacitively-coupled to a gate terminal of a first transistor of the differential pair transistors and a second terminal of the first inductor coupled to second, third, and fourth inductors, wherein the second inductor is coupled to a source terminal of the first transistor of the differential pair transistors, the fourth inductor is coupled to a source terminal of the second transistor of the differential pair transistors, the third inductor is capacitively-coupled to a gate terminal of the second transistor of the differential pair transistors and also to ground, and wherein a differential output of the LNA is provided at drain terminals of cascode transistors coupled to drain terminals of the differential pair transistors.

Assignments (5)
SECURITY AGREEMENT Recorded Jul 9, 2021
From: MAXLINEAR, INC.; MAXLINEAR COMMUNICATIONS, LLC; EXAR CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 056816/0089 →
RELEASE OF SECURITY INTEREST Recorded Jun 23, 2021
From: MUFG UNION BANK, N.A.
To: MAXLINEAR, INC.; EXAR CORPORATION; MAXLINEAR COMMUNICATIONS LLC
Reel/Frame 056656/0204 →
SUCCESSION OF AGENCY (REEL 042453 / FRAME 0001) Recorded Jul 1, 2020
From: JPMORGAN CHASE BANK, N.A.
To: MUFG UNION BANK, N.A.
Reel/Frame 053115/0842 →
SECURITY AGREEMENT Recorded May 12, 2017
From: MAXLINEAR, INC.; ENTROPIC COMMUNICATIONS, LLC (F/K/A ENTROPIC COMMUNICATIONS, INC.); EXAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042453/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2016
From: JAJOO, ABHISHEK; PAIDI, VAMSI
To: MAXLINEAR, INC.
Reel/Frame 039135/0541 →