Piezoelectric composite and method of forming same

1. A piezoelectric composite comprising a plurality of piezoelectric ceramic components and a hydrophobic polymer component, the hydrophobic polymer component being a polymerization product of a reaction mixture comprising an epoxide monomer and photoacid generator, wherein the plurality of piezoelectric ceramic components and the hydrophobic polymer component are arranged to form a composite type selected from the group consisting of a 1-3 composite type, a 2-2 composite type, and a 3-3 composite type.

2. The piezoelectric composite as recited in claim 1 , wherein the epoxide monomer is a siloxane epoxide monomer.

3. The piezoelectric composite as recited in claim 1 , wherein the epoxide monomer is a neat epoxide monomer.

4. The piezoelectric composite as recited in claim 3 , wherein the photoacid generator is present in the reaction mixture at a concentration between 0.25% by weight and 3% by weight.

5. The piezoelectric composite as recited in claim 1 , wherein the hydrophobic polymer is a polymerization product of a reaction mixture comprising the epoxide monomer, the photoacide generator, and an epoxide toughening monomer that is different than the epoxide monomer.

6. The piezoelectric composite as recited in claim 5 , wherein the epoxide toughening monomer comprises a plurality of dimethylsiloxane moieties and at least one epoxide moiety.

7. The piezoelectric composite as recited in claim 5 , wherein the epoxide toughening monomer is present in the reaction mixture at a concentration between 0.25% by weight and 40% by weight.

8. The piezoelectric composite as recited in claim 1 , wherein the hydrophobic polymer is a polymerization product of a reaction mixture comprising the epoxide monomer, the photoacid generator, an epoxide toughening monomer that is different than the epoxide monomer, and an adhesion promoter.

9. The piezoelectric composite as recited in claim 8 , wherein the adhesion promoter is present in the reaction mixture at a concentration between 0.25% by weight and 6% by weight.

10. The piezoelectric composite as recited in claim 1 , wherein the hydrophobic polymer component has less than a 4% change in mass when tested according to ASTM Standard D 570-90(2010)e1.

11. The piezoelectric composite as recited in claim 1 , wherein the piezoelectric composite type is a 1-3 composite type.

12. The piezoelectric composite as recited in claim 11 , wherein the plurality of piezoelectric ceramic components are posts having a length-to-width aspect ratio of at least 2.5 to 1.

13. The piezoelectric composite as recited in claim 1 , wherein the plurality of piezoelectric ceramic components and the hydrophobic polymer component are arranged such that the plurality of piezoelectric ceramic components occupies between 20% and 80% by volume of the piezoelectric composite.

14. The piezoelectric composite as recited in claim 13 , wherein the plurality of piezoelectric ceramic components and the hydrophobic polymer component are arranged such that the hydrophobic polymer component occupies between 20% and 80% by volume of the piezoelectric composite.

15. An ultrasonic transducer comprising:

a piezoelectric composite comprising a plurality of piezoelectric ceramic components and a hydrophobic polymer component, wherein the plurality of piezoelectric ceramic components and the hydrophobic polymer component are arranged to form a composite type selected from the group consisting of a 1-3 composite type, a 2-2 composite type and a 3-3 composite type;

a printed circuit board providing an electrical connection between the plurality of piezoelectric ceramic components and a cable;

a substrate contacting terminal ends of the plurality of piezoelectric ceramic components to provide an acoustic energy transmission window; and

a case, joined to the substrate to encase the piezoelectric composite and the printed circuit board, wherein the cable provides an electrical connection outside of the case.