PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC
Panelized packaging is described in which a plurality of die units are placed on a dielectric film. The dielectric film is then cured to lock the plurality of die unit in place, which are then encapsulated. The cured dielectric film is then patterned utilizing a mask-less pattering technique.
1 . A package comprising:
a non-photoirnageable dielectric film;
an active surface of a die unit attached to the dielectric film;
a redistribution layer (RDL) formed over the dielectric film and configured to be in electrical communication with the active surface of the die unit; and
an encapsulant layer comprising epoxy that encapsulates the die unit on the dielectric film;
wherein lateral edges of the encapsulant layer and the dielectric film are substantially flush.
2 . The package of claim 1 , further comprising:
a polymer layer disposed over the dielectric film; and
an opening formed in the polymer layer that exposes a RDL.
3 . The package of claim 1 , wherein the dielectric film and the encapsulant layer both comprise greater than approximately 50% of a ceramic or silica filler, by weight.
4 . The package of claim 1 , wherein the dielectric film and the encapsulant layer both have a glass transition temperature (Tg) greater than or equal to 140 degrees C.
5 . The package of claim 1 , wherein the encapsulant layer is disposed on a backside and four side surfaces of the die unit.
6 . The package of claim 1 , wherein the active surface of the die unit is substantially flush with a surface of the encapsulant layer on the dielectric film.
7 . The package of claim 1 , wherein the dielectric film comprises a thickness in a range of 5-50 micrometers.
8 . The package of claim 1 , further comprising:
a via formed through the dielectric film; and
a conductive material disposed within the via that is electrically coupled to the active surface of the die unit.
9 . A package comprising:
a non-photoimageable dielectric film;
an active surface of a die unit attached to the dielectric film; and
an encapsulant layer comprising epoxy that encapsulates the die unit on the dielectric film;
wherein the active surface of the die unit is substantially flush with a surface of the encapsulant layer on the dielectric film.
10 . The package of claim 9 , wherein the encapsulant layer is disposed on a backside and four side surfaces of the die unit.
11 . The package of claim 9 , wherein lateral edges of the encapsulant/capsulant layer and the dielectric film are substantially flush.
12 . The package of claim 9 , wherein the dielectric film and the encapsulant layer are formed of identical materials.
13 . The package of claim 9 , wherein the dielectric film and the encapsulant layer comprise a CTE of 11-18 ppm/° C. at room temperature.
14 . The package of claim 9 , wherein the dielectric film and the encapsulant layer both comprise greater than approximately 50% of a ceramic or silica filler, by weight.
15 . The package of claim 9 , wherein the dielectric film comprises a B-stage cured epoxy.
16 . A package comprising:
a dielectric film;
an active surface of a die unit attached to the dielectric film; and
an encapsulant layer comprising epoxy that encapsulates the die unit on the dielectric film;
wherein the dielectric film and the encapsulant layer both comprise greater than approximately 50% of a ceramic or silica filler, by weight.
17 . The package of claim 16 , further comprising:
a polymer layer disposed over the dielectric film; and
an opening formed in the polymer layer that exposes a redistribution layer (RDI) formed over the dielectric film and configured to be in electrical communication with the active surface of the die unit.
18 . The package of claim 16 , wherein the dielectric film and the encapsulant layer both have a glass transition temperature (Tg) greater than or equal to 140 degrees C.
19 . The package of claim 16 , wherein the dielectric film and the encapsulant layer comprise a CTE of 11-18 ppm/° C. at room temperature.
20 . The package of claim 17 , wherein the active surface of the die unit is substantially flush with a surface of the encapsulant layer on the dielectric film.
21 . The package of claim 17 , wherein lateral edges of the encapsulant layer and the dielectric film are substantially flush.