Making multi-layer micro-wire structure
View Patent ↗A method of making a multi-layer micro-wire structure resistant to cracking on a substrate having a surface including forming a plurality of micro-channels in the substrate, locating a first electrically conductive material composition forming a first layer in each micro-channel, and locating a second electrically conductive material composition having a greater tensile ductility than the first material composition to form a second layer in each micro-channel and in electrical contact with the first electrically conductive material composition thereby providing an electrically conductive multi-layer micro-wire in each micro-channel that is resistant to cracking.
1. A method of making a multi-layer micro-wire structure resistant to cracking on a flexible substrate having a surface, comprising:
forming a plurality of micro-channels in the substrate;
locating a first electrically conductive material composition forming a first layer in each micro-channel, wherein the first electrically conductive material composition is a conductive ink including conductive particles; and
locating a second electrically conductive material composition having a greater tensile ductility than the first material composition to form a second layer in each micro-channel that is in electrical contact with the first electrically conductive material composition, wherein the second electrically conductive material composition is a conductive polymer, and wherein the first and second layers together provide an electrically conductive multi-layer micro-wire in each micro-channel that is resistant to cracking when the multi-layer micro-wire structure is bent such that the multi-layer micro-wires wrap around a corner.
2. The method of claim 1 , further including locating the first material composition by coating the first material composition over the substrate surface and micro-channels and removing the first material composition from the surface but not from the micro-channels or further including locating the second material composition by coating the second material composition over the substrate surface and micro-channels and removing the second material composition from the surface but not from the micro-channels.
3. The method of claim 1 , further including locating the first or second material composition to fill only a portion of the micro-channels.
4. The method of claim 3 , further including wiping the surface to remove a portion of the first or second material composition from the micro-channels so that each micro-channel is only partially filled.
5. The method of claim 1 , further including reducing the volume of the first or second material composition in the micro-channels by evaporatively removing a portion of the first or second material composition.
6. The method of claim 1 , further including exposing the first or second material composition to an HCl vapor.
7. The method of claim 1 , further including providing the first material composition, curing the first material composition, and then providing the second material composition or providing the second material composition, curing the second material composition, and then providing the first material composition.
8. The method of claim 1 , wherein the first material includes silver.
9. The method of claim 1 , further including forming a plurality of electrodes, each electrode including a plurality of multi-layer micro-wires, and providing an unpatterned conductive layer electrically connected to the electrodes.
10. The method of claim 9 , wherein the unpatterned conductive layer includes the first material composition or the second material composition.
11. The method of claim 9 , further including locating the unpatterned conductive layer on the sides and bottom of each micro-channel.
12. The method of claim 9 , further including locating the unpatterned conductive layer on the top of each micro-channel and not locating the unpatterned conductive layer on the bottom of each micro-channel.
13. The method of claim 1 , further including locating a third layer in the micro-channel on a side of the second layer opposite the first layer, wherein the third layer includes the first material composition.
14. The method of claim 1 , further including locating a third layer in the micro-channel on a side of the first layer opposite the second layer, wherein the third layer includes the second material composition.
15. The method of claim 1 , further including a third electrically conductive material composition forming a third layer located on the bottom of the micro-channel, located in the micro-channel between the first and second layers, or located in the top of the micro-channel.
16. The method of claim 1 , further including coating a substrate with an uncured layer, coating the uncured layer with a conductive layer, imprinting the uncured layer and the conductive layer to form micro-channels having the conductive layer on at least a portion of the sides and bottom of the micro-channels, curing the uncured layer to form a cured layer, coating the conductive layer and micro-channels with a conductive ink, removing the conductive ink from the conductive layer on the cured layer surface and not the micro-channels, and curing the conductive ink in the micro-channels to form a multi-layer micro-wire structure in each micro-channel.
17. The method of claim 1 , further including coating a substrate with an uncured layer, imprinting the uncured layer to form micro-channels, curing the uncured layer to form a cured layer, coating the cured layer and micro-channels with a conductive ink, removing the conductive ink from the cured layer surface and not the micro-channels, and coating the cured layer and the conductive ink with a conductive layer to form a multi-layer micro-wire structure in each micro-channel.