IP Library Granted Patent US 9,676,887
Granted Patent B2
US 9,676,887 · App. 14/263,134 · Granted Jun 13, 2017

One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates

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Quick Facts
Patent No.
US 9,676,887
App. No.
14/263,134
Granted
Jun 13, 2017
Kind
B2
Abstract

Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have some terminal isocyanate groups that are capped with a phenol and other terminal isocyanate groups that are capped with a hydroxy-functional acrylate or a hydroxy-functional methacrylate. In certain embodiments, the presence of both types of capping on the toughener leads to higher impact peel strengths and a greater level of cohesive failure, than when the toughener is capped with a phenol an hydroxy-functional acrylate or hydroxy-functional methacrylate alone.

Claims (14)

1. A structural adhesive comprising:

A) at least one epoxy resin;

B) an elastomeric toughener represented by structure (I)

wherein p is from 1.5 to 8; wherein a portion of the A groups comprises a residue after removal from a hydrogen from a hydroxyl group of a hydroxy-functional acrylate or methacrylate; another portion of the A groups comprises a residue of a phenol; Y is a residue of an isocyanate-terminated prepolymer after removal of the terminal isocyanate groups; and Y comprises at least one elastomeric segment;

C) one or more epoxy curing agents;

D) a liquid rubber-modified epoxy resin, a core-shell rubber, or both a liquid rubber modified epoxy resin and a core-shell rubber;

E) a catalyst; and

F) a latent free radical initiator that can be activated by radiation or by heating to a temperature of from 80 to 130° C.

2. A cured composition obtained by curing the structural adhesive of claim 1 .

3. The cured composition of claim 2 , having a Young's modulus of about 1000 MPa or greater.

4. The cured composition of claim 2 , having a tensile strength of about 20 MPa or greater.

5. The structural adhesive of claim 1 , which when cured has a Young's modulus of about 1000 MPa or greater.

6. The structural adhesive of claim 1 , which when cured has a tensile strength of about 20 MPa or greater.

7. The structural adhesive of claim 1 which, when applied to cold rolled steel or galvaneal and cured to obtain a cured layer 1.5 mm thick, has a lap shear strength of about 15 MPa or greater.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
CHANGE OF LEGAL ENTITY Recorded Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2016
From: LUTZ, ANDREAS
To: DOW EUROPE GMBH
Reel/Frame 040242/0274 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2016
From: DOW EUROPE GMBH
To: THE DOW CHEMICAL COMPANY
Reel/Frame 040242/0300 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2016
From: THE DOW CHEMICAL COMPANY
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 040242/0316 →