Thin-film multi-layer micro-wire structure
View Patent ↗A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
1. A thin-film multi-layer micro-wire structure, comprising:
a substrate having a substrate surface;
a layer located on the substrate surface or forming a part of the substrate, the layer having a layer surface and one or more micro-channels in the layer, each of the one or more micro-channels having a width less than or equal to 20 microns;
a cured electrically conductive micro-wire located only in each micro-channel, the cured electrically conductive micro-wire having a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight; and
an electrolessly plated layer located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire, the electrolessly plated layer having a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form a thin-film multi-layer micro-wire.
2. The thin-film multi-layer micro-wire structure of claim 1 , wherein the thin-film multi-layer micro-wire has a length greater than or equal to 10 cm.
3. The thin-film multi-layer micro-wire structure of claim 1 , wherein the cured electrically conductive micro-wire is more than 50% silver by weight.
4. The thin-film multi-layer micro-wire structure of claim 1 , wherein the cured electrically conductive micro-wire has a thickness greater than zero and less than or equal to ten microns.
5. The thin-film multi-layer micro-wire structure of claim 1 , wherein the electrolessly plated layer has a thickness greater than zero and less than or equal to four microns.
6. The thin-film multi-layer micro-wire structure of claim 1 , wherein cured electrically conductive micro-wire includes micro-wire segments separated by a plurality of electrically open micro-gaps between the micro-wire segments.
7. The thin-film multi-layer micro-wire structure of claim 6 , wherein the electrically open micro-gaps have a length less than the width of the micro-channel in which the cured electrically conductive micro-wire is located.
8. The thin-film multi-layer micro-wire structure of claim 6 , wherein the electrically open micro-gaps between the micro-wire segments have a length less than one micron.
9. The thin-film multi-layer micro-wire structure of claim 6 , wherein the electrolessly plated layer forms a plated conductive bridge across each of the plurality of electrically open micro-gaps that electrically connects the micro-wire segments.
10. The thin-film multi-layer micro-wire structure of claim 9 , wherein each micro-wire is variably conductive and the conductivity variability of the thin-film multi-layer micro-wire is less than the conductivity variability of the thin-film multi-layer micro-wire.
11. The thin-film multi-layer micro-wire structure of claim 1 , wherein the electrolessly plated layer has a thickness less than one if half of the thickness of the micro-wire.
12. The thin-film multi-layer micro-wire structure of claim 1 , wherein the electrolessly plated layer has an electrical conductivity that is less than one half of the electrical conductivity of the micro-wire.
13. The thin-film multi-layer micro-wire structure of claim 1 , wherein the layer surface has a surface energy of 50 dynes/cm or greater or a water contact angle of greater than 60 degrees.
14. The thin-film multi-layer micro-wire structure of claim 1 , wherein the one or more micro-channels includes micro-channel surfaces that have the same surface energy as the layer surface.
15. The thin-film multi-layer micro-wire structure of claim 1 , wherein the electrolessly plated layer includes copper and a ratio of copper to silver in the electrolessly plated layer or thin-film multi-layer micro-wire is less than 50%.
16. The thin-film multi-layer micro-wire structure of claim 1 wherein the thin-film multi-layer micro-wire forms an antenna, at least a portion of an RFID, a bus line, an electrode, or at least a portion of an electrode in a touch sensor.
17. The thin-film multi-layer micro-wire structure of claim 16 wherein the thin-film multi-layer micro-wire is arranged in a spiral arrangement with a first terminal connection at one end of the thin-film multi-layer micro-wire and a second terminal connection at another end of the thin-film multi-layer micro-wire.
18. The thin-film multi-layer micro-wire structure of claim 1 wherein the thin-film multi-layer micro-wire comprises a first thin-film multi-layer micro-wire and further including a second thin-film multi-layer micro-wire electrically connected to the first thin-film multi-layer micro-wire, the first and second thin-film multi-layer micro-wires forming a conductor without electrically connecting to a third thin-film multi-layer micro-wire for a distance of at least 10 cm over the substrate.
19. A thin-film multi-layer micro-wire structure, comprising:
a substrate having a substrate surface;
a layer located on the substrate surface or forming a part of the substrate, the layer having a layer surface and one or more micro-channels in the layer, each micro-channel having a width less than or equal to 20 microns;
a cured electrically conductive micro-wire located only within each of the one or more micro-channels, the cured electrically conductive micro-wire having a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight;
an electrolessly plated layer located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire, the electrolessly plated layer having a thickness less than a thickness of the micro-wire so that the micro-wire and electrolessly plated layer form a thin-film multi-layer micro-wire; and
a cured material in each micro-channel in contact with the plated layer on a side of the plated layer opposite the micro-wire.
20. The thin-film multi-layer micro-wire structure of claim 19 , wherein the cured material is light absorbing.
21. The thin-film multi-layer micro-wire structure of claim 19 , wherein the cured electrically conductive micro-wire is a first micro-wire and the electrolessly plated layer is a first plated layer and wherein the cured material is a cured electrically conductive second micro-wire in electrical contact with the first plated layer.
22. The thin-film multi-layer micro-wire structure of claim 21 , wherein the second micro-wire includes silver nano-particles and has a percent ratio of silver that is greater than or equal to 40% by weight.
23. The thin-film multi-layer micro-wire structure of claim 21 , further including an electrolessly plated second plated layer within each micro-channel between the second micro-wire and the layer surface and in electrical contact with the cured electrically conductive second micro-wire, the electrolessly plated second plated layer having a thickness less than a thickness of the second micro-wire so that the first and second micro-wires and the first and second plated layers form the thin-film multi-layer micro-wire.
24. The thin-film multi-layer micro-wire structure of claim 21 , wherein each first micro-wire includes first micro-wire segments having electrically open first micro-gaps between the micro-wire segments in first locations within the one or more micro-channels and each second micro-wire includes second micro-wire segments separated by electrically open second micro-gaps between the second micro-wire segments in second locations within the micro-channel different from the first locations.