Light-emitting device

1. A method of fabricating a light-emitting device, comprising:

providing a single growth substrate, comprising a first major surface and a second major surface;

forming a plurality of first light-emitting stacks on the first major surface of the single growth substrate, wherein the first light-emitting stacks are electrically connected to each other via a first electrical connecting structure;

forming an electronic device on the second major surface of the single growth substrate; and

forming a second electrical connecting structure extending from the first major surface to the second major surface of the single growth substrate and electrically connecting the first light-emitting stacks and the electronic device,

wherein the electronic device comprises a resistance, an inductance, capacitance, or a rectifying device, and

wherein the material of the resistance comprises tantalum nitride (TaN), silicon-chromium alloy (SiCr), or nickel-chromium alloy (NiCr).

2. The method of fabricating the light-emitting device of claim 1 , wherein the rectifying device comprises a plurality of second semiconductor stacks.

3. The method of fabricating the light-emitting device of claim 1 , wherein the second major surface of the single growth substrate is devoid of light-emitting stack formed thereon.

4. The method of fabricating the light-emitting device of claim 2 , wherein the second semiconductor stacks comprise a light-emitting diode, a Zener diode, or a Schottky diode.

5. The method of fabricating the light-emitting device of claim 1 , further comprising covering a wavelength converting layer on the first light-emitting stacks, wherein the material of the wavelength converting layer comprises a fluorescent material or a phosphor material.

6. A method. of fabricating a light-emitting device, comprising:

providing a single growth substrate, comprising a first major surface and a second major surface;

forming a plurality of first light-emitting stacks on the first major surface of the single growth substrate, wherein the first light-emitting stacks are electrically connected to each other via a first electrical connecting structure;

forming an electronic device on the second major surface of the single growth substrate;

forming a second electrical connecting structure extending from the first major surface to the second major surface of the single growth substrate and electrically connecting the first light-emitting stacks and the electronic device; and

forming a heat dissipation layer on the second major surface of the single growth substrate, wherein the heat dissipation layer comprises a thermal conductivity larger than 50 W/mK.

7. The method of fabricating the light-emitting device of claim 6 , wherein the thickness of the heat dissipation layer is larger than 3 μm or the area of the heat dissipation layer is not smaller than 50% of that of the single growth substrate.

8. The method of fabricating the light-emitting device of claim 6 , wherein the material of the heat dissipation layer comprises copper, silver, gold, nickel, diamond, diamond-like carbon (DLC), aluminum nitride (AIN), graphite, carbon nanotube (CNT), or the composite thereof

9. The method of fabricating the light-emitting device of claim 1 , wherein the single growth substrate is a single layer structure.

10. The method of fabricating the light-emitting device of claim 1 , wherein the plurality of first light-emitting stacks are deposited on the first major surface of the single growth substrate by metal-organic chemical vapor deposition.

11. The method of fabricating the light-emitting device of claim 1 , wherein the electronic device is deposited on the second major surface of the single growth substrate by metal-organic chemical vapor deposition.

12. The method of fabricating the light-emitting device of claim 1 , further comprising forming a bump pad on the single growth substrate used for electrically connecting the light-emitting stacks and the electronic device with an external power source.

13. A method of fabricating a light-emitting device, comprising:

providing a single growth substrate, comprising a first major surface and a second major surface;

forming a plurality of light-emitting stacks on the first major surface of the single growth substrate; and

forming a bridge rectifying device and a passive device on the second major surface of the single growth substrate, wherein the light-emitting stacks, the bridge rectifying device, and the passive device are electrically connected to each other.

14. The method of fabricating the light-emitting device of claim 13 , wherein the passive device comprises a thin-film resistance, a thin-film inductance, or a thin-film capacitance.

15. The method of fabricating the light-emitting device of claim 13 , wherein the single growth substrate is a single layer structure.

16. The method of fabricating the light-emitting device of claim 13 , wherein the plurality of light-emitting stacks are deposited on the first major surface of the single growth substrate by metal-organic chemical vapor deposition.

17. The method of fabricating the light-emitting device of claim 13 , wherein the passive device is deposited on the second major surface of the single growth substrate by metal-organic chemical vapor deposition.

18. The method of fabricating the light-emitting device of claim 13 , wherein the second major surface of the single growth substrate is devoid of light-emitting stack formed thereon.

19. The method of fabricating the light-emitting device of claim 6 , wherein the single growth substrate is a single layer structure.

20. The method of fabricating the light-emitting device of claim 6 , wherein the plurality of first light-emitting stacks are deposited on the first major surface of the single growth substrate by metal-organic chemical vapor deposition.